RTL8211DN-VB-GR

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RTL8211DN-VB-GR

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規格

屬性 價值
Manufacturer Realtek Semicon
Package QFN-88-EP(10x10)

概述

Description

The RTL8211DN-VB-GR is a single-port Gigabit Ethernet PHY transceiver from Realtek, designed for high-speed networking applications. Key features include:
- Compliance: Supports IEEE 802.3az (Energy-Efficient Ethernet) and IEEE 802.3u/ab standards.
- Interfaces: MII, RMII, and RGMII for flexible MAC connectivity.
- Power Efficiency: Advanced power-saving modes for reduced energy consumption.
- Performance: Supports 10/100/1000 Mbps auto-negotiation and full/half-duplex operation.
- Package: 48-pin QFN (6x6mm), suitable for compact designs.
Commonly used in routers, switches, and embedded systems, it provides reliable Gigabit Ethernet connectivity with low power and cost efficiency.
For detailed specs, refer to the official datasheet.

Equivalent

Equivalent products to the RTL8211DN-VB-GR (10/100/1000M Ethernet PHY) include:
- RTL8211E-VB-CG (similar specs, different package)
- RTL8211F-CG (improved performance, lower power)
- KSZ9031RNX (from Microchip)
- DP83867IR (from Texas Instruments)
- AR8035 (from Qualcomm/Atheros)
These alternatives offer Gigabit Ethernet PHY functionality with comparable features. Verify pin compatibility and design requirements before substitution.

Features

The RTL8211DN-VB-GR is a single-port Gigabit Ethernet PHY transceiver with the following key features:
- Interface: Supports RGMII, MII, and RMII.
- Speed: 10/100/1000 Mbps auto-negotiation.
- Power: Low power consumption with advanced power-saving modes.
- Cable Support: Auto MDI/MDIX for easy cable connection.
- Compliance: IEEE 802.3, 802.3u, 802.3ab standards.
- Package: 48-pin QFN (6x6 mm).
- Temperature Range: Industrial-grade (-40°C to +85°C).
- Applications: Used in routers, switches, and embedded systems.
It integrates DSP and ADC for robust signal processing and supports jumbo frames.

Package

The RTL8211DN-VB-GR is a Gigabit Ethernet PHY transceiver from Realtek, packaged in a 32-pin QFN (Quad Flat No-lead) form factor (5x5 mm). This compact, lead-free package is designed for high-performance networking applications, offering efficient thermal dissipation and space-saving integration. It complies with RoHS standards, making it suitable for modern electronic designs.

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