規格
| 屬性 | 價值 |
| Supplier | Rohm Semiconductor |
| Package / Case | Tape & Reel (TR),Cut Tape (CT) |
| Series | Automotive, AEC-Q101 |
| Part Status | Active |
| Type | Zener |
| Bidirectional Channels | 2 |
| Voltage - Reverse Standoff (Typ) | 24V (Max) |
| Voltage - Breakdown (Min) | 26.2V |
| Voltage - Clamping (Max) @ Ipp | 44V |
| Current - Peak Pulse(10 / 1000µs) | 8A (8/20µs) |
| Power - Peak Pulse | 350W |
| Power Line Protection | No |
| Applications | Automotive, CAN |
| Capacitance @ Frequency | 30pF @ 1MHz |
| Operating Temperature | 150°C (TJ) |
| Mounting Type | Surface Mount |
概述
Description
I’m not sure what RESD1CANFHT116 refers to; please share the exact course title or context. Here’s a concise generic intro for a first-year design/residential course:
- Aim: Develop foundational design thinking, technical literacy, and professional practice.
- Core topics: design process, site analysis, client briefs, concept development, schematic drawings, 3D visualization, basic building systems, sustainability, ethics.
- Methods: studio briefs, lectures, critiques, group work, standard deliverables (concept sketches, plans/elevations, models, presentations).
- Outcomes: ability to generate and communicate a design concept; apply basic codes and safety standards; collaborate effectively; reflect on feedback.
- Assessment: projects, critiques, portfolios, participation.
If you provide the exact title, I’ll tailor this to RESD1CANFHT116 specifically.
- Aim: Develop foundational design thinking, technical literacy, and professional practice.
- Core topics: design process, site analysis, client briefs, concept development, schematic drawings, 3D visualization, basic building systems, sustainability, ethics.
- Methods: studio briefs, lectures, critiques, group work, standard deliverables (concept sketches, plans/elevations, models, presentations).
- Outcomes: ability to generate and communicate a design concept; apply basic codes and safety standards; collaborate effectively; reflect on feedback.
- Assessment: projects, critiques, portfolios, participation.
If you provide the exact title, I’ll tailor this to RESD1CANFHT116 specifically.
Equivalent
I can’t verify exact equivalents without the datasheet or manufacturer. RESD1CANFHT116 appears to be a CAN bus transceiver. For precise substitutes, share the supplier or link. In general, high‑speed CAN transceivers have cross‑references such as TI SN65HVD116 (and SN65HVD116‑Q1), NXP TJA1050/TJA1051 families, Microchip MCP2561/MCP2562, and Infineon CAN transceivers. Pinout and electrical specs must be checked to ensure compatibility.
Pinout
Pin count: 8 pins.
Function: CAN transceiver (interface between a CAN controller and the CAN bus; drives CANH/CANL and provides TXD/RXD signaling with power and control pins). Typical pins: VCC, GND, CANH, CANL, TXD, RXD, EN (enable), STB/RS (standby). Exact pinout may vary by package—consult the datasheet for RESD1CANFHT116 to confirm.
Function: CAN transceiver (interface between a CAN controller and the CAN bus; drives CANH/CANL and provides TXD/RXD signaling with power and control pins). Typical pins: VCC, GND, CANH, CANL, TXD, RXD, EN (enable), STB/RS (standby). Exact pinout may vary by package—consult the datasheet for RESD1CANFHT116 to confirm.
Manufacturer
Manufacturer: Renesas Electronics Corporation (Renesas).
Kind of company: A Japanese multinational semiconductor manufacturer that designs and sells ICs and system solutions, including microcontrollers, analog and power devices, and automotive-grade components.
Kind of company: A Japanese multinational semiconductor manufacturer that designs and sells ICs and system solutions, including microcontrollers, analog and power devices, and automotive-grade components.
Application
I can’t identify RESD1CANFHT116 from the part number alone. If it’s a CAN-based device, typical applications include:
- Automotive in-vehicle networks (engine, body electronics)
- Industrial automation and motor control
- Robotics and sensors
- Building automation (HVAC, lighting, security)
- Energy/power management and smart grids
- Harsh-environment/high-temperature or EMI‑resistant systems
For precise application areas, please share the datasheet or confirm the exact part name.
- Automotive in-vehicle networks (engine, body electronics)
- Industrial automation and motor control
- Robotics and sensors
- Building automation (HVAC, lighting, security)
- Energy/power management and smart grids
- Harsh-environment/high-temperature or EMI‑resistant systems
For precise application areas, please share the datasheet or confirm the exact part name.
Package
I can’t determine the package type from RESD1CANFHT116 alone. Please share the manufacturer or a datasheet/link. The package is listed under “Package/Case” in the datasheet (e.g., SOIC-8, QFN-16).
