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PGB1010603MR
+物料清單TVS DIODE 24VWM 150VC 0603
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製造商Littelfuse公司
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製造商部分 #PGB1010603MR
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有存貨7338
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正品保證
規格
| 屬性 | 價值 |
| Package / Case | Tape & Reel (TR),Cut Tape (CT) |
| Series | PulseGuard® PGB |
| Part Status | Active |
| Type | Zener |
| Bidirectional Channels | 1 |
| Voltage - Reverse Standoff (Typ) | 24V |
| Voltage - Clamping (Max) @ Ipp | 150V (Typ) |
| Power Line Protection | No |
| Applications | General Purpose |
| Operating Temperature | -65°C ~ 125°C (TJ) |
| Mounting Type | Surface Mount |
概述
Description
Equivalent
1. Littelfuse SP3010 series.
2. ON Semiconductor ESD7104 series.
3. Nexperia PESD5V0V1BL series.
4. STMicroelectronics ESDALC6-1BV2 series.
Please verify specifications such as working voltage, clamping voltage, capacitance, and package size to ensure compatibility.
Features
1. Power Rating: Indicates the maximum power the component can handle, usually measured in watts.
2. Tolerance: The precision of the component's specified value, typically represented as a percentage.
3. Temperature Coefficient: Describes how the component's value changes with temperature.
4. Package Type: Refers to the physical casing or form factor, such as surface-mount or through-hole.
5. Voltage Rating: Maximum voltage that the component can withstand without damage.
6. Size: Physical dimensions, which determine the suitability for compact or space-constrained applications.
7. Material Composition: Details about the materials used, which can affect performance and reliability.
8. Frequency Response: Applicable to components like capacitors and inductors, this indicates how they behave at different frequencies.
For precise information, consulting the manufacturer's datasheet or technical specifications is recommended, as these documents provide detailed insights into the component’s characteristics and suitable applications.
Pinout
The PGB1010603MR is packaged in a 0603 footprint, which is a standard surface mount package size. It offers bidirectional protection and can clamp ESD voltages to safer levels, ensuring the longevity and reliability of electronic systems. Its small size and efficient protection make it suitable for integration into densely packed electronic designs.