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PCF8563TS/4
+物料清單Real Time Clock PCF8563TS/TSSOP8//4/REEL 13 Q1/T1 *STANDARD MARK
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製造商恩智浦電晶體
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製造商部分 #PCF8563TS/4
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概述
Description
Key features:
- I²C-bus interface (400 kHz max) for communication.
- Programmable clock output (32.768 kHz to 1 Hz).
- Ultra-low power (~0.25 µA typical at 3V).
- Integrated oscillator capacitor (no external components needed).
- Battery backup support for continuous timekeeping.
Applications include embedded systems, smart meters, wearables, and IoT devices. The TS/4 variant comes in a TSSOP8 package.
For setup, configure via I²C, initialize time/date registers, and optionally enable alarms or clock output.
Equivalent
- DS3231 (higher accuracy, temperature-compensated)
- MCP7940N (I2C, battery backup)
- RX-8025SA (I2C, low power)
- DS1307 (older, less accurate)
- MAX31328 (I2C, high precision)
These alternatives offer similar RTC functionality with varying features like accuracy, power consumption, or additional alarms. Choose based on your project's needs.
Pinout
- Pin Count: 8 pins (SO8 package)
- Key Functions:
- SCL: Serial clock input (I²C)
- SDA: Serial data line (I²C)
- INT: Interrupt output (open-drain)
- CLKOUT: Programmable clock output (32.768 kHz, 1 Hz, etc.)
- VDD/VSS: Power supply (1.0V–5.5V) and ground
- OSCI/OSCO: 32.768 kHz crystal oscillator connections
It provides timekeeping (seconds to years), alarms, timer functions, and a programmable clock output. Commonly used in embedded systems for accurate timekeeping.
Application
1. Consumer Electronics – Clocks in smart devices, TVs, and appliances.
2. Industrial Systems – Timestamping for data logging and automation.
3. Automotive – Dashboard clocks and event scheduling.
4. Embedded Systems – Microcontroller-based projects needing timekeeping.
5. IoT Devices – Battery-powered sensors requiring accurate timing.
Its features include I²C interface, alarm functions, and ultra-low power consumption, making it ideal for portable and energy-efficient applications.
Package
It measures approximately 3.0 x 4.4 mm and is surface-mountable. This package type is compact, suitable for space-constrained designs, and commonly used in consumer electronics, IoT devices, and embedded systems.