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規格
| 屬性 | 價值 |
| EU Ro HS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | EA |
| Automotive | Unknown |
| PPAP | Unknown |
| Mounting Type | Surface Mount |
| Package Height | 0.48(Max) |
| Package Width | 10 |
| Package Length | 15 |
| PCB changed | 200 |
| Package / Case | BGA |
| Supplier Device Package | FBGA |
| Pin Count | 200 |
概述
Description
The NT6AN256T32AV-J2 is a type of DRAM (Dynamic Random Access Memory) module, typically used in high-performance computing and networking applications. It belongs to the LPDDR4X (Low Power Double Data Rate 4X) family, which is designed to provide fast data rates with reduced power consumption compared to previous DRAM generations. This makes it particularly suitable for mobile devices, embedded systems, and other applications where power efficiency is critical.
This module is characterized by its high density and bandwidth, offering 256 Mbit storage organized in a specific configuration, which allows for faster data processing and efficient multitasking. The "J2" in the part number may denote specific packaging or speed grading, but would require the manufacturer's documentation for precise details.
Overall, the NT6AN256T32AV-J2 is designed for systems that demand high-speed data processing and energy efficiency, making it ideal for modern consumer electronics, automotive, and IoT devices.
This module is characterized by its high density and bandwidth, offering 256 Mbit storage organized in a specific configuration, which allows for faster data processing and efficient multitasking. The "J2" in the part number may denote specific packaging or speed grading, but would require the manufacturer's documentation for precise details.
Overall, the NT6AN256T32AV-J2 is designed for systems that demand high-speed data processing and energy efficiency, making it ideal for modern consumer electronics, automotive, and IoT devices.
Equivalent
The NT6AN256T32AV-J2 is a DRAM chip designed for applications requiring high-speed, high-density memory. Equivalent products would include DRAM chips with similar specifications such as DDR4 or LPDDR4/4X memory with comparable capacity and speed. Examples might include modules from manufacturers like Samsung, Micron, or SK Hynix that offer equivalent performance and capacity in similar form factors. Always verify specifications like voltage, pin configuration, and operating temperature to ensure compatibility.
Features
The NT6AN256T32AV-J2 is a DRAM module characterized by its high-performance and power efficiency, suitable for a range of applications. It features a 256M x 32-bit configuration, totaling 8Gb of memory capacity, and is constructed on advanced technology that supports the LPDDR4X standard. This module operates at a low voltage, typically around 0.6V for the core, promoting efficient power consumption. It offers a high data transfer rate and is equipped with a double data rate architecture to double the bandwidth. The NT6AN256T32AV-J2 also includes various features such as on-die termination (ODT) and programmable READ/WRITE latency. It supports a wide operating temperature range, making it versatile for use in different environmental conditions. Error correction and cyclic redundancy check algorithms ensure data integrity and reliability. This DRAM module is ideal for applications requiring high-speed data processing and low power, such as mobile devices, automotive systems, and other embedded applications.
Pinout
The NT6AN256T32AV-J2 is a DRAM chip, specifically a low-power DDR3 (LPDDR3) memory device. It comes in a package with 134 pins. As for its function, this chip provides high-speed data transfer rates and is used in various applications such as mobile devices, tablets, and other portable electronics where power efficiency and high performance are desired.
The device uses a double data rate architecture to achieve high-speed operation. The 256Mb (megabit) configuration indicates the density of the memory, and the 32-bit width allows for efficient data handling. It supports a range of power-saving features, making it suitable for battery-operated devices. The chip operates on a low voltage, typically around 1.2V, which is standard for LPDDR3 devices, further contributing to its energy efficiency.
The device uses a double data rate architecture to achieve high-speed operation. The 256Mb (megabit) configuration indicates the density of the memory, and the 32-bit width allows for efficient data handling. It supports a range of power-saving features, making it suitable for battery-operated devices. The chip operates on a low voltage, typically around 1.2V, which is standard for LPDDR3 devices, further contributing to its energy efficiency.
Manufacturer
The NT6AN256T32AV-J2 is manufactured by Nanya Technology Corporation. Nanya Technology is a Taiwanese company that specializes in the design, development, and manufacturing of dynamic random-access memory (DRAM) products. The company is one of the major DRAM manufacturers globally and focuses on providing memory solutions for a variety of applications, including consumer electronics, mobile devices, servers, and personal computers. Nanya Technology is known for its innovation in memory technology and its commitment to delivering high-quality products to meet the demands of the rapidly evolving tech industry.
Application
The NT6AN256T32AV-J2 is a type of DRAM (Dynamic Random Access Memory) used in various applications. Its primary application areas include:
1. Consumer Electronics: Used in smartphones, tablets, and laptops for fast data processing and efficient multitasking.
2. Networking Equipment: Supports high-speed data transfer in routers, switches, and other network devices.
3. Automotive Systems: Provides memory solutions for infotainment systems, advanced driver-assistance systems (ADAS), and other automotive electronics.
4. Industrial Applications: Used in embedded systems and IoT devices for real-time data processing and storage.
5. Cloud Computing: Supports data centers and servers by enhancing data processing speeds and storage capabilities.
These applications leverage its high-speed performance and reliability.
1. Consumer Electronics: Used in smartphones, tablets, and laptops for fast data processing and efficient multitasking.
2. Networking Equipment: Supports high-speed data transfer in routers, switches, and other network devices.
3. Automotive Systems: Provides memory solutions for infotainment systems, advanced driver-assistance systems (ADAS), and other automotive electronics.
4. Industrial Applications: Used in embedded systems and IoT devices for real-time data processing and storage.
5. Cloud Computing: Supports data centers and servers by enhancing data processing speeds and storage capabilities.
These applications leverage its high-speed performance and reliability.
Package
The NT6AN256T32AV-J2 is a DRAM package type. It is typically a multi-chip package (MCP) that combines DRAM and potentially other types of memory or logic. Specific details about the package dimensions or configuration should be obtained from the manufacturer's datasheet for precise information.
Frequently Asked Questions
Q: What is the standard package type and pin count for NT6AN256T32AV-J2?
A: This Nanya component comes in a 200-pin FBGA (Fine-Pitch Ball Grid Array) package, ideal for space-constrained surface mount designs.
Q: Is NT6AN256T32AV-J2 compliant with EU RoHS regulations?
A: Yes, based on specifications, it is listed as EU RoHS Compliant (EAR99 ECCN), suitable for global market use.
Q: What are the key physical dimensions of this FBGA package?
A: The package measures 15mm (length) x 10mm (width) with a maximum height of 0.48mm, making it ultra-thin.
Q: Is this part suitable for automotive or high-reliability applications?
A: No, as per specs, Automotive and PPAP status are listed as "Unknown", so it is recommended for commercial/industrial use.
Q: What is the mounting style required for this component?
A: It requires Surface Mount (SMD/SMT) assembly, compliant with standard FBGA soldering processes.
Q: Does this part have active lifecycle status for long-term procurement?
A: Yes, its Part Status is listed as "Active", ensuring ongoing production availability for project planning.
