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MX25R3235FZNIL0
+物料清單IC FLASH 32MBIT SPI/QUAD 8WSON
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製造商部分 #MX25R3235FZNIL0
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規格
| 屬性 | 價值 |
| Series | MXSMIO™ |
| Part Status | Not For New Designs |
| Base Product Number | MX25R3235 |
| DigiKey Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR |
| Memory Size | 32Mbit |
| Memory Organization | 4M x 8 |
| Memory Interface | SPI - Quad I/O |
| Clock Frequency | 33 MHz |
| Write Cycle Time - Word, Page | 100µs, 10ms |
| Voltage - Supply | 1.65V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package | 8-WDFN Exposed Pad |
| Supplier Device Package | 8-WSON (6x5) |
| Packaging | Tray |
概述
Description
- Memory Type: NOR Flash with a 3V operating voltage.
- Data Transfer Rate: Supports up to 133 MHz clock speed, allowing for fast read and write operations.
- Interface: Quad SPI, enabling higher data throughput compared to traditional SPI.
- Erase and Write: Offers sector, block, and chip erase capabilities, along with a high endurance rating for repeated write cycles.
- Low Power Consumption: Designed for energy-efficient applications, with deep power-down modes.
This chip is ideal for applications requiring reliable, high-performance memory storage, such as firmware storage in embedded systems and data logging.
Equivalent
1. Winbond W25Q32JV
2. Micron MT25QL032
3. SPANSION S25FL032P
4. NXP/Freescale M25P32
5. SST SST26VF032B
When selecting equivalents, ensure compatibility in voltage, speed, and pin configuration.
Features
- Interface: Supports Quad SPI (QSPI) and Dual I/O, enabling high-speed data transfer.
- Operating Voltage: 2.7V to 3.6V, making it suitable for various low-power applications.
- Sector Architecture: Features a uniform sector layout with a 64KB sector size, allowing flexible erasure and programming.
- Read Speed: Up to 104 MHz, providing fast read access times.
- Memory Organization: 4M x 8 bits configuration for versatile data handling.
- Endurance: Supports 100,000 program/erase cycles per sector.
- Data Retention: Retains data for 20 years at 125°C.
- Package: Available in a small 8-pin SOIC or WSON packages, ideal for space-constrained applications.
- Security Features: Includes OTP (One-Time Programmable) memory and hardware write protection.
This device is often used in consumer electronics, automotive, and industrial applications requiring reliable non-volatile storage.
Pinout
1. VCC: Power supply.
2. GND: Ground.
3. SCK: Serial clock input; used to synchronize data transmission.
4. CS# (Chip Select): Active low signal to select the device for communication.
5. IO0: Bidirectional data input/output for serial communication.
6. IO1: Bidirectional data input/output for serial communication.
7. IO2: Bidirectional data input/output for serial communication (used in Quad SPI mode).
8. IO3: Bidirectional data input/output for serial communication (used in Quad SPI mode).
This chip supports various features including standard SPI, Dual SPI, and Quad SPI modes, enabling flexible data transfer rates and efficient memory operations.
Manufacturer
Application
Package
Frequently Asked Questions
Q: What is the memory size and organization of the MX25R3235FZNIL0?
A: It has a 32Mbit memory size organized as 4M x 8 bits, suitable for code storage and data logging.
Q: What memory interface does this component support?
A: It supports SPI with Quad I/O, enabling high-speed data transfer up to 33 MHz for efficient read/write operations.
Q: What is the operating voltage range for this NOR Flash device?
A: It operates from 1.65V to 3.6V, making it suitable for low-power and battery-powered designs.
Q: What are the write cycle times for word and page operations?
A: Word write cycle time is 100μs, and page write cycle time is 10ms, ensuring reliable programming performance.
Q: What is the operating temperature range for this component?
A: It operates from -40°C to 85°C (TA), suitable for industrial and commercial environments.
Q: What package options are available for the MX25R3235FZNIL0?
A: It comes in an 8-WDFN exposed pad package, with a supplier device package of 8-WSON (6x5mm), surface-mount only.
Q: Is this component recommended for new designs?
A: No, its part status is "Not For New Designs," so it is best suited for existing designs or legacy support.