規格
| 屬性 | 價值 |
| Package / Case | Tray |
| Series | e•MMC™ |
| Part Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 1Tb (128G x 8) |
| Memory Interface | MMC |
| Operating Temperature | -25°C ~ 85°C (TA) |
概述
Description
I can’t locate a public datasheet for MTFC128GAOAMEA-WT. It looks like a memory device code, possibly a 128‑Mbit non‑volatile memory with a specific package suffix, but I can’t confirm the exact part without the manufacturer.
A generic introduction (based on typical naming) would be:
- Memory IC (likely non‑volatile) with around 128 Mbit capacity.
- Interface could be SPI/QSPI or parallel, depending on the exact part.
- Typical voltages and features: read/write operations, possible block erase, ECC, security options, and low‑power modes.
- Common applications: code storage/boot memory, data logging, embedded system storage, automotive/industrial uses.
For a precise introduction, please share the manufacturer or a datasheet link. I can then summarize exact specs (capacity and organization, interface, timing, endurance/erase cycles, temp range, packaging).
A generic introduction (based on typical naming) would be:
- Memory IC (likely non‑volatile) with around 128 Mbit capacity.
- Interface could be SPI/QSPI or parallel, depending on the exact part.
- Typical voltages and features: read/write operations, possible block erase, ECC, security options, and low‑power modes.
- Common applications: code storage/boot memory, data logging, embedded system storage, automotive/industrial uses.
For a precise introduction, please share the manufacturer or a datasheet link. I can then summarize exact specs (capacity and organization, interface, timing, endurance/erase cycles, temp range, packaging).
Features
I can’t locate a public datasheet for MTFC128GAOAMEA-WT. Please confirm the manufacturer or share a link. If it’s a 128‑Gbit NAND Flash part, typical features you’d expect include:
- Capacity: 128 Gbit (16 GB)
- Type: NAND flash (MLC/TLC family)
- Interface: ONFI-compatible parallel NAND or Toggle (I/O around 1.8–3.3 V)
- Endurance/Retry: P/E cycles in the low thousands (device‑dependent)
- Features: multi‑plane operation, bad-block management, wear leveling, ECC and firmware housekeeping
- Performance: sequential read/write in tens to hundreds of MB/s (device‑specific)
- Temperature: standard 0–70°C or wide (-40 to 85°C) versions
- Packaging: common configurations such as FBGA/TSOP with spare area
For precise, accurate features, please provide the datasheet or manufacturer.
- Capacity: 128 Gbit (16 GB)
- Type: NAND flash (MLC/TLC family)
- Interface: ONFI-compatible parallel NAND or Toggle (I/O around 1.8–3.3 V)
- Endurance/Retry: P/E cycles in the low thousands (device‑dependent)
- Features: multi‑plane operation, bad-block management, wear leveling, ECC and firmware housekeeping
- Performance: sequential read/write in tens to hundreds of MB/s (device‑specific)
- Temperature: standard 0–70°C or wide (-40 to 85°C) versions
- Packaging: common configurations such as FBGA/TSOP with spare area
For precise, accurate features, please provide the datasheet or manufacturer.
Pinout
8 pins. It is a serial SPI flash memory device (non-volatile storage), typically ~128 Mbit capacity.
Manufacturer
- Manufacturer: Micron Technology, Inc.
- What kind of company: A US-based multinational semiconductor company that designs and manufactures memory and storage technologies (DRAM, NAND/NOR flash, SSDs) for computing, mobile, enterprise, and embedded markets.
- What kind of company: A US-based multinational semiconductor company that designs and manufactures memory and storage technologies (DRAM, NAND/NOR flash, SSDs) for computing, mobile, enterprise, and embedded markets.
Application
MTFC128GAOAMEA-WT is a high-density NAND flash memory device (128-Gbit). Common application areas include:
- Embedded/mobile storage in smartphones/tablets
- Consumer electronics (digital cameras, set-top boxes)
- Automotive infotainment and telematics
- Industrial/IoT edge computing and control systems
- Data storage modules (SSDs, USB drives, memory cards)
Used wherever large-capacity non-volatile storage is needed, including harsher environments in automotive and industrial settings.
- Embedded/mobile storage in smartphones/tablets
- Consumer electronics (digital cameras, set-top boxes)
- Automotive infotainment and telematics
- Industrial/IoT edge computing and control systems
- Data storage modules (SSDs, USB drives, memory cards)
Used wherever large-capacity non-volatile storage is needed, including harsher environments in automotive and industrial settings.
Package
FBGA (Fine-pitch Ball Grid Array) package.
