MT61K512M32KPA-16:E

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MT61K512M32KPA-16:E

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IC DRAM 16GBIT POD 180FBGA

  • 製造商美光科技股份有限公司。

  • 製造商部分 #MT61K512M32KPA-16:E

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正品保證

規格

屬性 價值
Part Status Active
Base Product Number MT61K512
Memory Format DRAM
Technology SGRAM - GDDR6
Memory Size 16Gbit
Memory Organization 512M x 32
Memory Interface POD_135
Packaging Tray

概述

Description

MT61K512M32KPA-16:E is a Micron memory device (MT61K family). It is a DRAM chip used as a fast, volatile storage element in embedded/portable systems. Key points:
- Density/organization: approximately 512 megabits of storage; designed with a wide data interface and banked structure (typical MT61K devices use multi-bank organization and sizable page sizes).
- Interface and timing: synchronous DRAM interface that requires proper clocking and command sequencing (ACT, READ/WRITE, PRECHARGE, REFRESH).
- Electricals: low-voltage operation with standard DRAM power and decoupling requirements; timing parameters depend on the exact variant.
- Suffix meaning (typical): -16 denotes a speed grade (around 16 ns or equivalent performance parameter); E often indicates an extended temperature grade.
Note: exact word size, bank count, voltage, and timing are variant-dependent. For precise specs (data width, organization, voltage, timings, and temperature range), consult the official Micron MT61K512M32KPA-16:E datasheet.

Equivalent

Exact equivalents depend on memory type, package, voltage and speed. MT61K512M32KPA-16:E is a Micron MT61K-series device; to give pin-compatible substitutes I need specs or the datasheet. Please confirm:
- memory type and organization (e.g., 512M x 32)
- package
- operating voltage
- speed grade
With those, I can map to potential Hynix/Samsung/Micron equivalents.

Manufacturer

- Manufacturer: Micron Technology, Inc.
- What kind of company: An American multinational semiconductor company that designs and manufactures memory and storage products (DRAM, NAND/NOR flash) for computers and electronics.

Application

Potential application areas for MT61K512M32KPA-16:E include:
- Mobile and embedded systems (smartphones, tablets, wearables)
- Graphics, video buffers and display memory (set-top boxes, TVs, cameras)
- Automotive applications (infotainment, ECUs, ADAS memory)
- Networking and telecommunications equipment (routers, switches, base stations)
- Industrial and consumer electronics (POS systems, printers, medical devices)
Note: it is a high-density memory device suitable for main memory or buffer roles where large capacity and efficiency are required.

Package

FBGA (Fine-pitch Ball Grid Array); RoHS-compliant lead-free (-E).

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