MT44K16M36RB-093F:B

MT44K16M36RB-093F:B is a memory IC (an MT‑series part). The exact type (SRAM vs DRAM), capacity, and timing depend on the manufacturer’s datasheet, but the part name generally indicates:
- 16‑bit data width (the “16” in the code)
- High-density memory in the MT44K16M36RB family
- A specific speed grade indicated by “-093F”
- A package/qualification variant noted by “:B”
In practice, such devices are used as fast storage for data in embedded systems or PCs and require address, data, and control signals, along with a power supply. They are usually volatile memory (data lost when power is removed), unless explicitly noted as non-volatile.
For an accurate introduction with exact capacity, voltage, timings, and pinout, please supply or obtain the vendor’s datasheet for MT44K16M36RB-093F:B (manufacturers commonly include Micron/others). If you share the supplier, I can summarize the precise specs.

I don’t have the exact datasheet on hand for MT44K16M36RB-093F:B. Here are the typical features you’d expect for a Micron MT44K16M36RB-type device (server ECC/registered DIMM memory):
- Density/organization: 576 Mbit total, 16M x 36-bit data path (32 data bits + 4 ECC)
- Data path: ECC-protected wide data (x36) for server DIMMs
- Interface: registered/buffered SDRAM typically used in memory modules
- Voltage: standard low-voltage operation (around 1.5V for DDR-era devices)
- Refresh: internal/self-refresh with programmable refresh controls
- Temperature range: industrial/extended (typical -40°C to 85°C)
- Applications: server/workstation memory modules, ECC RAM
Note: these are inferred characteristics. For exact timing (tRCD, tRP, tRAS), speed grade, package type, and voltage, please provide the official datasheet or share it here.

Manufacturer: Micron Technology, Inc.
What kind of company: A US-based semiconductor company that designs and manufactures memory and storage products (DRAM, NAND/NOR Flash, SSDs, and related technologies).

MT44K16M36RB-093F:B is a DRAM memory device. Common application areas include:
- Desktop and notebook PCs as main memory
- Graphics cards and display buffering
- Embedded systems and consumer electronics (TVs, set‑top boxes, game consoles)
- Networking/telecom equipment (routers, switches)
- Automotive electronics (instrument clusters, infotainment, ECUs)
- Industrial automation and IoT devices requiring fast RAM

TSOP-II (Thin Small Outline Package) for DRAM.