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MT41K128M8DA-107:J
+物料清單IC DRAM 1GBIT PAR 78FBGA
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製造商部分 #MT41K128M8DA-107:J
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規格
| 屬性 | 價值 |
| Part Status | Last Time Buy |
| Base Product Number | MT41K128M8 |
| Digi Key Programmable | Not Verified |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - DDR3L |
| Memory Size | 1Gbit |
| Memory Organization | 128M x 8 |
| Memory Interface | Parallel |
| Clock Frequency | 933 MHz |
| Voltage - Supply | 1.283V ~ 1.45V |
| Operating Temperature | 0°C ~ 95°C (TC) |
| Mounting Type | Surface Mount |
| Package / Case | 78-TFBGA |
| Supplier Device Package | 78-FBGA (8x10.5) |
| Packaging | Tray |
| Access Time | 20 ns |
概述
Description
Key features of this chip include:
- Density: 1 Gigabit, organized as 128 Meg x 8 bits.
- Speed: Operates at a clock speed of up to 933 MHz, providing data transfer rates of up to 1866 MT/s (million transfers per second).
- Package: Comes in a standard JEDEC-compliant FBGA (Fine-Pitch Ball Grid Array) package, ensuring compatibility with various motherboard designs.
- Operating Voltage: Designed for 1.5V operation, contributing to lower power consumption compared to previous DDR2 standards.
- Temperature Range: Suitable for a wide range of operating temperatures, making it versatile for different environments.
This chip's high performance and low power consumption make it suitable for modern high-performance and energy-efficient applications.
Equivalent
1. Samsung K4B4G0846D - DDR3L SDRAM with similar specifications.
2. Hynix H5TC4G83CFR - Offers comparable performance and features.
3. Nanya NT5CB128M8CN-CG - Another alternative with similar characteristics.
4. Kingston D2516EC4BXGGB - Matches the performance metrics for DDR3L SDRAM.
Ensure compatibility with your specific device requirements when selecting an equivalent.
Features
1. Density and Organization: It has a capacity of 1Gb (Gigabit) and is organized as 128 Meg x 8 bits.
2. Data Rate and Speed: It supports data rates of up to DDR3-2133, with a clock speed of 1066 MHz (frequency).
3. Voltage: Operates at a voltage of 1.5V, which is standard for DDR3 memory.
4. Package Type: The DRAM comes in a 78-ball FBGA (Fine-pitch Ball Grid Array) package.
5. CAS Latency: Features a CAS (Column Address Strobe) latency of 7, 8, 9, 10, or 11, which determines the delay time between the read command and the availability of data.
6. Temperature Range: Designed to operate in a temperature range suitable for standard consumer electronics.
These features make it suitable for a wide range of applications, including personal computers and consumer electronics, where high-speed data access and processing are required.
Pinout
Key functions and features include:
1. Data Transfer Rate: Operates at DDR3 speeds, supporting data rates up to 1866 MT/s depending on the specific device speed grade.
2. Voltage: Operates at a standard voltage of 1.5V.
3. Density and Configuration: With a total density of 1 Gigabit, it is configured as 128 Meg x 8 bits.
4. Bank Architecture: Utilizes an 8-bank architecture for improved performance and efficiency.
5. Applications: Suitable for a wide range of applications including computing devices, networking equipment, and consumer electronics.
For precise pin functions such as address, data, and control signals, refer to the device datasheet or technical manual provided by Micron. The specific pinout in the ball grid array might include functions such as power, ground, data input/output, clock signals, and command signals.
Manufacturer
Application
1. Computing: Used in desktops, laptops, and servers for efficient data processing and multitasking capabilities.
2. Consumer Electronics: Integrated into devices like gaming consoles, smart TVs, and home entertainment systems to enhance performance.
3. Networking: Supports routers, switches, and other networking equipment for faster data transmission.
4. Automotive: Deployed in advanced driver-assistance systems (ADAS) and infotainment systems for better functionality and reliability.
5. Industrial: Employed in automation systems and industrial controls for robust operations.
These applications leverage the chip’s high-speed data handling and low power consumption characteristics.
Package
Frequently Asked Questions
Q: What is the maximum operating frequency of this DDR3L SDRAM?
A: The MT41K128M8DA-107:J supports a maximum clock frequency of 933 MHz, corresponding to a DDR3L-1866 data rate.
Q: What is the supply voltage range for this device?
A: It operates at a low voltage range of 1.283V to 1.45V, compliant with the DDR3L (1.35V) standard for power efficiency.
Q: Is this memory component suitable for industrial temperature applications?
A: No, its operating temperature range is 0°C to 95°C (TC), making it suitable for commercial or extended temperature environments, not industrial (-40°C to 85°C).
Q: What is the access time for a typical read operation?
A: The access time is rated at 20 ns, ensuring reliable data retrieval within the specified timing parameters.
Q: What is the standard mounting and packaging type for this component?
A: It comes in a 78-ball TFBGA (Thin Fine-Pitch Ball Grid Array) surface-mount package, supplied in a tray format.
Q: How is the memory internally organized?
A: The device has a memory organization of 128M x 8 bits, providing a total storage capacity of 1 Gbit (128 MB).