規格
| 屬性 | 價值 |
| Package / Case | Tray |
| Part Status | Obsolete |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 384Gb (48G x 8) |
| Memory Interface | Parallel |
| Clock Frequency | 267 MHz |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Mounting Type | Surface Mount |
概述
Description
MT29F384G08EBCBBJ4-37:B is a Micron NAND flash memory device. It is a 384‑Gbit (≈48‑GByte) non‑volatile storage chip with an x8 NAND interface, designed to be used with a NAND flash controller. The device is a multi‑level cell (MLC) NAND with multi‑plane architecture for parallel operation and ONFI‑compliant signaling. The suffixes (-37:B) encode process/grade and revision details from Micron.
Typical organization features pages of a few kilobytes and erase blocks of tens of kilobytes, along with wear leveling and ECC functionality managed by the controller. It targets embedded storage, SSDs, cameras, and other consumer/electronic applications.
For exact electrical specs (voltage, timing), page and spare sizes, block structure, reliability figures, and production parameters, consult the MT29F384G08EBCBBJ4 datasheet and packaging documents.
Typical organization features pages of a few kilobytes and erase blocks of tens of kilobytes, along with wear leveling and ECC functionality managed by the controller. It targets embedded storage, SSDs, cameras, and other consumer/electronic applications.
For exact electrical specs (voltage, timing), page and spare sizes, block structure, reliability figures, and production parameters, consult the MT29F384G08EBCBBJ4 datasheet and packaging documents.
Equivalent
Equivalents depend on exact specs. The MT29F384G08EBCBBJ4-37:B is a 384‑Gbit ONFi NAND; cross‑references vary by density, ONFi version, I/O (x8/x16), voltage, and package. Please supply: ONFi version, voltage (1.8/3.3V), package, and temperature. With that I’ll list closest equivalents (e.g., Samsung, Kioxia/Toshiba, SK hynix) and their part numbers.
Pinout
- Pin count: 48-pin (TSOP-48)
- Function: 8‑bit wide parallel NAND flash memory (non-volatile storage) with standard NAND flash interface (CLE, ALE, CE, WE, RE, DQ0–DQ7; ONFI-compliant).
- Function: 8‑bit wide parallel NAND flash memory (non-volatile storage) with standard NAND flash interface (CLE, ALE, CE, WE, RE, DQ0–DQ7; ONFI-compliant).
Manufacturer
- Manufacturer: Micron Technology, Inc.
- What kind of company: An American multinational semiconductor company that designs and manufactures memory and storage technologies (DRAM and NAND flash) for computers, data centers, mobile devices, and consumer electronics.
- What kind of company: An American multinational semiconductor company that designs and manufactures memory and storage technologies (DRAM and NAND flash) for computers, data centers, mobile devices, and consumer electronics.
Application
Application areas:
- Embedded non-volatile storage in mobile devices, cameras and consumer electronics
- Boot/firmware storage for embedded systems, IoT and industrial equipment
- NAND-based solid-state drives and other SSD-type storage
- USB flash drives and memory cards
- Automotive (infotainment, telematics, instrument clusters) and industrial automation
- Networking equipment needing firmware/config storage
- Data-logging and rugged storage in harsh environments
- Embedded non-volatile storage in mobile devices, cameras and consumer electronics
- Boot/firmware storage for embedded systems, IoT and industrial equipment
- NAND-based solid-state drives and other SSD-type storage
- USB flash drives and memory cards
- Automotive (infotainment, telematics, instrument clusters) and industrial automation
- Networking equipment needing firmware/config storage
- Data-logging and rugged storage in harsh environments
Package
Package type: BGA, specifically FBGA (fine-pitch Ball Grid Array).
