MT29F16G08CBACAWP:C

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MT29F16G08CBACAWP:C

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IC FLASH 16GBIT PAR 48TSOP I

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規格

屬性 價值
Part Status Obsolete
Base Product Number MT29F16G08
Digi Key Programmable Not Verified
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND
Memory Size 16Gbit
Memory Organization 2G x 8
Memory Interface Parallel
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case 48-TFSOP (0.724", 18.40mm Width)
Supplier Device Package 48-TSOP I
Packaging Bulk

概述

Description

The MT29F16G08CBACAWP:C is a NAND Flash memory chip produced by Micron Technology. It is part of their 16Gb (Gigabit) multi-level cell (MLC) NAND series, designed for use in a variety of storage applications, including solid-state drives (SSDs), embedded systems, and other digital storage solutions. This chip uses a standard NAND interface, making it compatible with a wide range of controllers and systems.
Key features of this chip include high-density storage, a relatively low cost per bit, and efficient power consumption, which are advantageous for portable and battery-powered devices. It supports standard NAND commands and has mechanisms for error correction to enhance data integrity. The chip also offers a balance between performance and reliability, with good endurance characteristics suitable for applications requiring frequent read/write cycles.
The "CAWP" in the part number likely denotes specific packaging or feature sets, while "C" may indicate a revision or specific temperature range and operational characteristics, though these should be verified in Micron's official datasheets for precise specifications.

Equivalent

The MT29F16G08CBACAWP:C is a NAND flash memory chip by Micron Technology. Equivalent products would be those with similar specifications from other manufacturers. These could include models like the K9F1G08U0F from Samsung, the TH58NVG4S0FT from Toshiba, or the H27UCG8T2ATR from SK Hynix. Always verify compatibility in terms of memory size, architecture, interface, and voltage requirements when considering equivalent products.

Features

The MT29F16G08CBACAWP:C is a NAND flash memory chip developed by Micron Technology. Here are some of its key features:
1. Capacity: It offers a storage capacity of 16 Gigabits, suitable for various data storage applications.

2. Architecture: The chip uses a multi-level cell (MLC) architecture, allowing each cell to store more than one bit of information.
3. Interface: It utilizes an 8-bit I/O interface for data transfer, enabling efficient communication with the host controller.
4. Performance: The chip provides high-speed data read and write operations, making it suitable for both consumer and industrial applications.
5. Endurance: With advanced wear-leveling algorithms and error correction, it ensures reliable data retention and longevity over numerous write/erase cycles.
6. Voltage: It operates at a typical voltage range, making it compatible with standard power supplies in electronic devices.
7. Package: The chip is available in a compact package, facilitating easy integration into various electronic devices and systems.
These features make the MT29F16G08CBACAWP:C a versatile and reliable choice for embedded and portable storage solutions.

Pinout

The MT29F16G08CBACAWP:C is a NAND flash memory chip manufactured by Micron Technology. This chip is part of Micron's MT29 series of NAND flash products. It features a total of 48 pins, which are used for various functions such as power supply, data input/output, command inputs, and control signals.
Key functions of the pins include:
- Power Supply Pins: Vcc and Vss for core power and ground.
- Data Input/Output: I/O pins for reading and writing data.
- Control Pins: CLE (Command Latch Enable), ALE (Address Latch Enable), WE# (Write Enable), RE# (Read Enable), and CE# (Chip Enable).
- Additional Functional Pins: WP# (Write Protect), R/B# (Ready/Busy), and spare pins for custom configurations.
This NAND flash memory is used in various applications that require non-volatile storage, such as solid-state drives, memory cards, and other embedded systems. The pin configuration ensures efficient data management and control, making it suitable for high-performance and reliable memory solutions.

Manufacturer

The MT29F16G08CBACAWP:C is manufactured by Micron Technology, Inc. Micron is a well-known American corporation that specializes in the production of semiconductor devices, primarily focusing on memory and storage solutions. The company produces a range of products including DRAM, NAND flash memory, and other semiconductor components used in a variety of electronics. Micron is considered one of the leading companies in the memory industry and serves a global market, supplying essential components for personal computers, mobile devices, data centers, and automotive and industrial applications. Founded in 1978 and headquartered in Boise, Idaho, Micron has grown to become a major player in the technology sector, known for its innovation and contribution to advances in memory technology.

Application

The MT29F16G08CBACAWP:C is a NAND Flash memory chip, commonly used in various applications requiring reliable data storage. Key areas include:
1. Consumer Electronics: Used in smartphones, tablets, and digital cameras for efficient data storage.
2. Computing: Incorporated in solid-state drives (SSDs) for faster read/write operations compared to traditional hard drives.
3. Embedded Systems: Utilized in industrial, automotive, and IoT devices for durable and compact storage solutions.
4. Networking: Employed in routers and switches for firmware and configuration storage.
5. Enterprise Storage: Used in data centers for high-density and scalable storage solutions.
Overall, its versatility makes it suitable for both consumer and professional applications requiring robust flash memory.

Package

The package type of the MT29F16G08CBACAWP:C is a 48-pin TSOP (Thin Small Outline Package). TSOP packages are commonly used for NAND flash memory devices, offering a compact form factor suitable for a variety of electronic applications.

Frequently Asked Questions


Q: What is the memory density and organization of this NAND Flash?
A: It offers 16Gbit (16Gb) density, organized as 2G x 8 bits, ideal for high-density data storage.


Q: Does this component operate with a 1.8V supply?
A: No, it requires a voltage supply range of 2.7V to 3.6V, making it a 3.3V typical device.


Q: What interface does it use for data transfer?
A: It uses a standard Parallel interface (x8 I/O), suitable for legacy or high-throughput embedded systems.


Q: What is the operating temperature range?
A: It is rated for commercial temperature from 0°C to 70°C (TA), not suitable for industrial or automotive extended range.


Q: Is this part still in active production?
A: According to specifications, its Part Status is "Obsolete"; check stock availability before new designs.


Q: What package type does this memory come in?
A: It comes in a 48-TFSOP (18.40mm Width) package, with a 48-TSOP I supplier device package.


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