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MT29F16G08CBACAWP:C
+物料清單IC FLASH 16GBIT PAR 48TSOP I
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製造商部分 #MT29F16G08CBACAWP:C
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規格
| 屬性 | 價值 |
| Part Status | Obsolete |
| Base Product Number | MT29F16G08 |
| Digi Key Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 16Gbit |
| Memory Organization | 2G x 8 |
| Memory Interface | Parallel |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 48-TFSOP (0.724", 18.40mm Width) |
| Supplier Device Package | 48-TSOP I |
| Packaging | Bulk |
概述
Description
Key features of this chip include high-density storage, a relatively low cost per bit, and efficient power consumption, which are advantageous for portable and battery-powered devices. It supports standard NAND commands and has mechanisms for error correction to enhance data integrity. The chip also offers a balance between performance and reliability, with good endurance characteristics suitable for applications requiring frequent read/write cycles.
The "CAWP" in the part number likely denotes specific packaging or feature sets, while "C" may indicate a revision or specific temperature range and operational characteristics, though these should be verified in Micron's official datasheets for precise specifications.
Equivalent
Features
1. Capacity: It offers a storage capacity of 16 Gigabits, suitable for various data storage applications.
2. Architecture: The chip uses a multi-level cell (MLC) architecture, allowing each cell to store more than one bit of information.
3. Interface: It utilizes an 8-bit I/O interface for data transfer, enabling efficient communication with the host controller.
4. Performance: The chip provides high-speed data read and write operations, making it suitable for both consumer and industrial applications.
5. Endurance: With advanced wear-leveling algorithms and error correction, it ensures reliable data retention and longevity over numerous write/erase cycles.
6. Voltage: It operates at a typical voltage range, making it compatible with standard power supplies in electronic devices.
7. Package: The chip is available in a compact package, facilitating easy integration into various electronic devices and systems.
These features make the MT29F16G08CBACAWP:C a versatile and reliable choice for embedded and portable storage solutions.
Pinout
Key functions of the pins include:
- Power Supply Pins: Vcc and Vss for core power and ground.
- Data Input/Output: I/O pins for reading and writing data.
- Control Pins: CLE (Command Latch Enable), ALE (Address Latch Enable), WE# (Write Enable), RE# (Read Enable), and CE# (Chip Enable).
- Additional Functional Pins: WP# (Write Protect), R/B# (Ready/Busy), and spare pins for custom configurations.
This NAND flash memory is used in various applications that require non-volatile storage, such as solid-state drives, memory cards, and other embedded systems. The pin configuration ensures efficient data management and control, making it suitable for high-performance and reliable memory solutions.
Manufacturer
Application
1. Consumer Electronics: Used in smartphones, tablets, and digital cameras for efficient data storage.
2. Computing: Incorporated in solid-state drives (SSDs) for faster read/write operations compared to traditional hard drives.
3. Embedded Systems: Utilized in industrial, automotive, and IoT devices for durable and compact storage solutions.
4. Networking: Employed in routers and switches for firmware and configuration storage.
5. Enterprise Storage: Used in data centers for high-density and scalable storage solutions.
Overall, its versatility makes it suitable for both consumer and professional applications requiring robust flash memory.
Package
Frequently Asked Questions
Q: What is the memory density and organization of this NAND Flash?
A: It offers 16Gbit (16Gb) density, organized as 2G x 8 bits, ideal for high-density data storage.
Q: Does this component operate with a 1.8V supply?
A: No, it requires a voltage supply range of 2.7V to 3.6V, making it a 3.3V typical device.
Q: What interface does it use for data transfer?
A: It uses a standard Parallel interface (x8 I/O), suitable for legacy or high-throughput embedded systems.
Q: What is the operating temperature range?
A: It is rated for commercial temperature from 0°C to 70°C (TA), not suitable for industrial or automotive extended range.
Q: Is this part still in active production?
A: According to specifications, its Part Status is "Obsolete"; check stock availability before new designs.
Q: What package type does this memory come in?
A: It comes in a 48-TFSOP (18.40mm Width) package, with a 48-TSOP I supplier device package.