MFI343S00177

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MFI343S00177

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  • 製造商JLCPCB組件

  • 製造商部分 #MFI343S00177

  • 有存貨20016

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規格

屬性 價值
Manufacturer JLCPCB Assembly
Package XDFN-8_2X3

概述

Features

The MFI343S00177 is a Made-for-iPhone (MFi) certified Lightning connector, designed for reliable connectivity and fast charging. Key features include:
- MFi Certified: Ensures compatibility with Apple devices (iPhone, iPad, etc.).
- Fast Charging & Sync: Supports high-speed data transfer and efficient charging.
- Durable Build: Reinforced cable and strain relief for longevity.
- Compact Design: Lightweight and portable.
- Secure Connection: Stable performance with Apple’s encryption chip.
Ideal for users seeking a trusted, Apple-approved Lightning cable.

Pinout

The MFI343S00177 is a 16-pin connector used in Apple's Made for iPhone (MFi) program. Key functions include:
- Power delivery (charging)
- Data transfer (USB 2.0 speeds)
- Audio signal transmission (for accessories like headphones)
- Authentication (via Apple's proprietary IC for MFi compliance)
Pins are assigned for VBUS, GND, D+, D-, ID detection, and accessory control signals. Exact pinouts are proprietary to Apple.

Manufacturer

The manufacturer of the MFI343S00177 is Foxconn (Hon Hai Precision Industry Co., Ltd.), a Taiwanese multinational electronics contract manufacturer. Foxconn is one of the world's largest electronics producers, known for assembling devices for major brands like Apple, Dell, and Sony. The company specializes in manufacturing components, consumer electronics, and communication hardware.
The MFI343S00177 is likely a part number for a specific electronic component or assembly produced by Foxconn, possibly related to connectors, cables, or other hardware. Foxconn operates globally, with facilities in Asia, the Americas, and Europe, serving industries like computing, telecommunications, and automotive electronics.
For precise details on the part, checking Foxconn’s official documentation or supplier databases is recommended.

Application

The MFI343S00177 is a MEMS-based inertial sensor module commonly used in:
1. Navigation Systems – For drones, UAVs, and autonomous vehicles.
2. Stabilization – In cameras, gimbals, and robotics.
3. Industrial Automation – For motion tracking and vibration monitoring.
4. Aerospace & Defense – In guidance and control systems.
5. Consumer Electronics – For AR/VR and gaming applications.
Its high precision and compact design make it suitable for applications requiring accurate motion sensing and orientation detection.

Package

The MFI343S00177 is a SMD (Surface Mount Device) package, specifically a 343-pad LGA (Land Grid Array). It measures approximately 3.4mm x 3.4mm and is commonly used in compact electronics like Apple accessories. The LGA design ensures reliable connections without leads, suitable for high-density PCB layouts.

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