FSL136MR

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The FSL136MR is a Fairchild/ON Semiconductor integrated PWM controller for power supply applications. Equivalent products include the Power Integrations TinySwitch series, such as the TNY series (e.g., TNY268PN), and the NXP TEA1733 series. Additionally, Infineon's ICE2A series and STMicroelectronics' VIPer series can be considered as alternatives, depending on specific requirements like power rating and application. It’s important to verify electrical characteristics and pin compatibility when selecting a substitute.

The FSL136MR is a power switch IC designed for high-efficiency power management. Its key features include:
1. Integrated Functionality: Combines a power MOSFET and a current-mode PWM controller into a single package, simplifying design and reducing component count.
2. High Efficiency: Optimized for high efficiency during both light-load and full-load conditions, which reduces energy consumption and heat generation.
3. Protection Features: Includes over-voltage protection (OVP), over-current protection (OCP), and over-temperature protection (OTP) to ensure safe operation and enhance the reliability of the device.
4. Low Standby Power: Designed to minimize standby power consumption, making it suitable for energy-efficient applications.
5. Wide Input Voltage Range: Capable of operating over a wide input voltage range, providing flexibility for various power supply designs.
6. Compact Package: Available in a compact and thermally efficient package, facilitating use in space-constrained applications.
These features make the FSL136MR particularly suited for applications like adapters, chargers, and other power supply systems where efficiency and safety are crucial.

The FSL136MR is an integrated Power Switch (IPS) designed for off-line switch mode power supplies. It typically comes in an 8-pin Small Outline Package (SOP). Here's a brief overview of its pin functions:
1. Vcc: Supplies the operating voltage to the IC.
2. GND: Ground pin, which acts as the reference point for all signals.
3. DRAIN: Connected to the internal high-voltage power MOSFET drain terminal.
4. FB (Feedback): Receives the feedback voltage from the output for regulation purposes.
5. NC (No Connect): These pins are typically not internally connected and can be used for mechanical support.
6. Vstr: Start-up voltage to enable the initial power-up of the IC.
7. SenseFET Source (S): Provides the return path for the SenseFET current.
8. COMP (Compensation): Used to stabilize the control loop of the power supply.
These pins collectively allow the FSL136MR to manage power conversion efficiently in various applications, such as in chargers and adapters.

The FSL136MR is manufactured by ON Semiconductor, a global company specializing in the design and manufacture of semiconductors and integrated circuits. ON Semiconductor provides a broad range of products that serve various applications across different industries, such as automotive, communications, computing, consumer electronics, industrial, and medical sectors. The company is known for its focus on energy-efficient innovations, offering solutions that contribute to reducing energy consumption and improving performance in electronic devices.

The FSL136MR is a compact LED driver IC designed for lighting applications. Its main application areas include:
1. LED Lighting: It is used in various LED lighting solutions such as residential, commercial, and industrial lighting fixtures.

2. Retrofit Bulbs: Suitable for integration into retrofit bulb designs, allowing for energy-efficient upgrades to existing lighting systems.

3. Display Panels: Utilized in signage and display panels where consistent and efficient LED operation is essential.
4. Backlighting: Employed in backlighting for TVs, monitors, and other display devices to ensure uniform brightness and energy efficiency.
These applications benefit from the IC’s high efficiency, compact design, and reliability.

The FSL136MR is typically available in a TO-220 package, which is a common type of through-hole semiconductor package. This package is often used for power semiconductors because it can handle higher power dissipation levels due to its larger size and metal tab for heat sinking.