規格
| 屬性 | 價值 |
| Package / Case | Bulk |
| Series | PowerTrench® |
| Part Status | Active |
| FET Type | P-Channel |
| Technology | MOSFET (Metal Oxide) |
| Drain to Source Voltage (Vdss) | 20 V |
| Current - Continuous Drain(Id) @ 25°C | 8A (Ta) |
| Drive Voltage(Max Rds On Min Rds On) | 2.5V, 4.5V |
| Rds On(Max) @ Id Vgs | 24mOhm @ 8A, 4.5V |
| Vgs(th)(Max) @ Id | 1.5V @ 250µA |
| Gate Charge(Qg)(Max) @ Vgs | 36 nC @ 4.5 V |
| Vgs(Max) | ±8V |
| Input Capacitance(Ciss)(Max) @ Vds | 2694 pF @ 10 V |
| Power Dissipation (Max) | 2.5W (Ta) |
| Operating Temperature | -55°C ~ 175°C (TJ) |
| Mounting Type | Surface Mount |
| Supplier Device Package | 8-SOIC |
概述
Description
Introduction to FDS6375
FDS6375 is a PowerTrench® MOSFET by ON Semiconductor, designed for high-efficiency power management in applications like DC-DC converters, motor control, and load switching. Key features include:
- Low On-Resistance (RDS(on)): Enhances efficiency by minimizing conduction losses.
- Fast Switching: Optimized for high-frequency operation.
- Low Gate Charge (Qg): Reduces drive power requirements.
- Avalanche Energy Rated: Improves reliability in rugged conditions.
Available in a compact DPAK (TO-252) package, it supports voltages up to 30V and currents up to 30A, making it suitable for automotive, industrial, and consumer electronics. Its advanced PowerTrench® technology ensures thermal performance and durability.
For detailed specs, refer to the [datasheet](https://www.onsemi.com).
FDS6375 is a PowerTrench® MOSFET by ON Semiconductor, designed for high-efficiency power management in applications like DC-DC converters, motor control, and load switching. Key features include:
- Low On-Resistance (RDS(on)): Enhances efficiency by minimizing conduction losses.
- Fast Switching: Optimized for high-frequency operation.
- Low Gate Charge (Qg): Reduces drive power requirements.
- Avalanche Energy Rated: Improves reliability in rugged conditions.
Available in a compact DPAK (TO-252) package, it supports voltages up to 30V and currents up to 30A, making it suitable for automotive, industrial, and consumer electronics. Its advanced PowerTrench® technology ensures thermal performance and durability.
For detailed specs, refer to the [datasheet](https://www.onsemi.com).
Equivalent
Equivalent products to the FDS6375 (30V P-channel MOSFET) include:
- SI2301DS (Vishay)
- AO3401A (Alpha & Omega)
- IRLML6401 (Infineon)
- DMG2305UX (Diodes Inc.)
These are similar in specs (voltage, current, package). Verify exact parameters for your application.
- SI2301DS (Vishay)
- AO3401A (Alpha & Omega)
- IRLML6401 (Infineon)
- DMG2305UX (Diodes Inc.)
These are similar in specs (voltage, current, package). Verify exact parameters for your application.
Features
The FDS6375 is an N-channel PowerTrench MOSFET with the following key features:
- Voltage Rating: 30V
- Current Rating: 50A (continuous)
- Low On-Resistance (RDS(on)): 4.5mΩ (max) @ VGS = 10V
- Fast Switching: Optimized for high-efficiency applications
- Low Gate Charge (Qg): Reduces switching losses
- Avalanche Energy Rated: Enhances ruggedness
- PowerTrench® Technology: Improves thermal performance and efficiency
- Package: SO-8 (Compact surface-mount design)
Ideal for DC-DC converters, motor control, and power management in automotive, industrial, and consumer electronics.
- Voltage Rating: 30V
- Current Rating: 50A (continuous)
- Low On-Resistance (RDS(on)): 4.5mΩ (max) @ VGS = 10V
- Fast Switching: Optimized for high-efficiency applications
- Low Gate Charge (Qg): Reduces switching losses
- Avalanche Energy Rated: Enhances ruggedness
- PowerTrench® Technology: Improves thermal performance and efficiency
- Package: SO-8 (Compact surface-mount design)
Ideal for DC-DC converters, motor control, and power management in automotive, industrial, and consumer electronics.
Package
The FDS6375 is a dual N-channel MOSFET available in an SO-8 (Small Outline 8-pin) package. This surface-mount package is compact and widely used for power management applications. It features a lead pitch of 1.27mm and is compatible with standard PCB assembly processes. The SO-8 package ensures efficient thermal performance and space-saving integration.
