規格
| 屬性 | 價值 |
| Package / Case | Tape & Reel (TR),Cut Tape (CT) |
| Part Status | Active |
| Output Configuration | Half Bridge (2) |
| Applications | General Purpose |
| Interface | Logic, PWM |
| Load Type | Inductive |
| Technology | Power MOSFET |
| Current - Output / Channel | 55A |
| Current - Peak Output | 70A |
| Voltage - Supply | 4.5V ~ 5.5V |
| Voltage - Load | 4.5V ~ 16V |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Fault Protection | Current Limiting, Over Temperature, UVLO |
| Mounting Type | Surface Mount |
概述
Description
FDMF3170 is likely a course code and while specific details can vary by institution, it typically represents a specialized course within a curriculum, often focusing on advanced topics in a particular field. Given the structure of the code, it could be associated with disciplines such as finance, data management, or a related field. Introduction to FDMF3170 might cover foundational concepts necessary for understanding more complex theories and applications addressed in the course. Students might explore various methodologies, frameworks, or tools relevant to the subject matter, and gain practical skills through assignments and projects. To get precise details, you would need to refer to the course syllabus or contact the academic department offering the course, as they can provide specific information regarding the topics covered, learning objectives, prerequisites, and any required materials or texts.
Equivalent
The FDMF3170 is an integrated power stage module primarily used for synchronous buck converters. Equivalent or similar products would typically be integrated power stages or DrMOS solutions from other manufacturers. Some potential equivalents include:
1. Infineon's IR3553
2. Texas Instruments' CSD97370Q4M
3. Vishay's SiC620
4. ON Semiconductor's FDMF6823C
These are comparable in function but specifications like current ratings or voltage limits may vary, so always check datasheets for compatibility.
1. Infineon's IR3553
2. Texas Instruments' CSD97370Q4M
3. Vishay's SiC620
4. ON Semiconductor's FDMF6823C
These are comparable in function but specifications like current ratings or voltage limits may vary, so always check datasheets for compatibility.
Features
The FDMF3170 is an integrated power stage module designed for high-efficiency DC-DC synchronous buck power applications. Key features include:
1. Integrated Drivers and MOSFETs: Combines high-speed drivers and highly efficient MOSFETs, optimizing performance in compact designs.
2. High Efficiency: Designed for high-efficiency operation, minimizing power losses and improving thermal management.
3. Low RDS(on): Features low on-state resistance (RDS(on)) for both the high-side and low-side MOSFETs, which reduces conduction losses.
4. High Switching Frequency: Capable of operating at high switching frequencies, which aids in reducing the size of external components such as inductors and capacitors.
5. Integrated Bootstrap Diode: Simplifies the PCB layout by eliminating the need for an external bootstrap diode.
6. Protection Features: Includes various protection mechanisms such as over-temperature protection, under-voltage lockout, and over-current protection to enhance reliability.
7. Compact Package: Comes in a small package, which is ideal for space-constrained applications.
These features make the FDMF3170 suitable for use in computing, telecommunications, and other electronics that require efficient power delivery solutions.
1. Integrated Drivers and MOSFETs: Combines high-speed drivers and highly efficient MOSFETs, optimizing performance in compact designs.
2. High Efficiency: Designed for high-efficiency operation, minimizing power losses and improving thermal management.
3. Low RDS(on): Features low on-state resistance (RDS(on)) for both the high-side and low-side MOSFETs, which reduces conduction losses.
4. High Switching Frequency: Capable of operating at high switching frequencies, which aids in reducing the size of external components such as inductors and capacitors.
5. Integrated Bootstrap Diode: Simplifies the PCB layout by eliminating the need for an external bootstrap diode.
6. Protection Features: Includes various protection mechanisms such as over-temperature protection, under-voltage lockout, and over-current protection to enhance reliability.
7. Compact Package: Comes in a small package, which is ideal for space-constrained applications.
These features make the FDMF3170 suitable for use in computing, telecommunications, and other electronics that require efficient power delivery solutions.
Pinout
The FDMF3170 is a module commonly used in power management applications. It is a 6x6mm PQFN package with 44 pins. The module integrates a driver IC, two power MOSFETs, and a Schottky diode, forming a complete power stage for a synchronous buck converter.
Key functions of the FDMF3170 include:
1. Switching Control: It controls the high-side and low-side MOSFETs to efficiently convert voltage levels in applications like DC-DC converters.
2. Integrated Driver: The driver IC enables efficient switching of the power MOSFETs, reducing the need for external components.
3. Protection Features: The module includes over-temperature protection, under-voltage lockout, and shoot-through protection for reliable operation.
4. Thermal Management: Its design allows for effective heat dissipation, improving performance and reliability.
This integration reduces design complexity and helps in achieving higher power density in power management applications.
Key functions of the FDMF3170 include:
1. Switching Control: It controls the high-side and low-side MOSFETs to efficiently convert voltage levels in applications like DC-DC converters.
2. Integrated Driver: The driver IC enables efficient switching of the power MOSFETs, reducing the need for external components.
3. Protection Features: The module includes over-temperature protection, under-voltage lockout, and shoot-through protection for reliable operation.
4. Thermal Management: Its design allows for effective heat dissipation, improving performance and reliability.
This integration reduces design complexity and helps in achieving higher power density in power management applications.
Manufacturer
The FDMF3170 is manufactured by ON Semiconductor. ON Semiconductor is a company that designs and manufactures semiconductors and provides a variety of solutions in the electronic components industry. The company focuses on automotive, industrial, cloud power, and Internet of Things (IoT) applications. It provides a comprehensive range of products including power management, analog, sensors, logic, timing, connectivity, discrete, SoC, and custom devices.
Application
The FDMF3170 is a compact power module primarily used in power management applications. It finds applications in synchronous buck converters, which are prevalent in voltage regulation for computing and server systems. Its high efficiency and integrated design make it suitable for use in data centers, telecommunications equipment, and networking infrastructure. Additionally, it's used in power supplies for high-performance graphics cards and gaming consoles. The FDMF3170 is valued in these areas for its ability to improve power density and thermal performance, while reducing overall system size and cost.
Package
The FDMF3170 is a power module typically used in electronic applications. It comes in a PQFN (Power Quad Flat No-lead) package, which is known for its compact size and efficient heat dissipation properties, making it suitable for high-density and thermally challenging environments.