EP3SL150F780I3N

圖片僅供參考

EP3SL150F780I3N

+物料清單

IC FPGA 488 I/O 780FBGA

365 天品質保證

7*24 小時服務保證

90-日售後保障

正品保證

規格

屬性 價值
Supplier Intel
Package Tray
Series Stratix® III L
ProductStatus Obsolete
NumberofLABs/CLBs 5700
NumberofLogicElements/Cells 142500
TotalRAMBits 6543360
NumberofI/O 488
Voltage-Supply 0.86V ~ 1.15V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 780-BBGA, FCBGA

概述

Description

EP3SL150F780I3N is an Altera (now Intel) Cyclone III FPGA device. It targets cost‑sensitive, high‑volume designs needing moderate density and low power. Key points:
- Density: about 150K logic elements (LEs) in a 780‑ball FBGA package.
- I/O: hundreds of user I/Os across I/O banks.
- On‑chip resources: memory blocks (M9K), DSP blocks, and clock management PLLs.
- I/O standards: supports multiple standard interfaces across banks.
- Package/characteristics: industrial temperature option (I3N suffix) with a 780‑pin package.
- Flow: programmed with Intel (formerly Altera) Quartus II software; HDL design (Verilog/VHDL); generate programming files (SOF/POF).
Common uses include digital control, embedded networking, video/signal processing, and other mid‑to‑high density FPGA applications where low cost and moderate performance are priorities. The device is part of the Cyclone III family, designed for efficient power usage and rapid development cycles.

Features

Here are the typical features of the EP3SL150F780I3N (Stratix III, 150K LE, 780-pin package):
- FPGA family: Stratix III (EP3SL series)
- Logic density: ~150K logic elements (LEs)
- Package: 780-pin FineLine BGA
- I/O: numerous 3.3V-compatible I/O banks (I/O count depends on package)
- Core power: 1.2V core; I/O banks typically 2.5V/3.3V tolerant
- Embedded memory: on-chip RAM blocks (memory resources scale with device)
- DSP/logic: DSP/multiplier blocks for high‑end signal processing
- Clocking: multiple PLLs/clock-management resources for complex timing
- SerDes/transceivers: high‑speed SERDES for serial protocols and interfaces
- Reconfigurability: support for dynamic/partial reconfiguration via IP and fabric
- Temperature: industrial-grade variants available
Note: exact RAM block sizes, IO count, and transceiver speeds vary by device revision and packaging. Check the specific datasheet for precise numbers.

Pinout

- Pin count: 780 pins
- Function: Altera/Intel EP3SL150F780I3N is a Cyclone III FPGA device (≈150K logic elements) in a 780-pin FineLine BGA package, a general-purpose programmable logic device.

Manufacturer

- Manufacturer: Xilinx, Inc. (now a subsidiary of AMD).
- Company type: A multinational American semiconductor company that designs and sells programmable logic devices (FPGAs, CPLDs) and related software/IP; historically fabless in manufacturing.

Application

EP3SL150F780I3N is a Stratix III FPGA. Common application areas include:
- Telecom and networking (packet processing, switches, line cards)
- Digital signal processing and DSP accelerators
- Image/video processing and high-speed video interfaces
- High-performance embedded systems and hardware accelerators
- Industrial automation, motor control, robotics
- Aerospace/military and ruggedized embedded systems
- Data acquisition, test instrumentation, and prototyping
(Note: device supports high I/O, DSP, and transceivers suitable for demanding, reconfigurable applications.)

Package

It uses a 780-ball fine-pitch BGA package (FBGA780).

與EP3SL150F780I3N相關的產品