圖片僅供參考
DFE21CCN2R2MELL
+物料清單FIXED IND 2.2UH 1.8A 138 MOHM
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製造商村田電子
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製造商部分 #DFE21CCN2R2MELL
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規格
| 屬性 | 價值 |
| Series | DFE21CCN_EL |
| Part Status | Active |
| Type | Drum Core, Wirewound |
| Material - Core | Metal |
| Inductance | 2.2 µH |
| Tolerance | ±20% |
| Current Rating (Amps) | 1.8 A |
| Current - Saturation (Isat) | 2.1A |
| Shielding | Shielded |
| DC Resistance (DCR) | 138mOhm Max |
| Operating Temperature | -40°C ~ 125°C |
| Inductance Frequency - Test | 1 MHz |
| Mounting Type | Surface Mount |
| Package | 0805 (2012 Metric) |
| Supplier Device Package | 0805 |
| Size / Dimension | 0.079" L x 0.047" W (2.00mm x 1.20mm) |
| Height - Seated (Max) | 0.031" (0.80mm) |
| Packaging | Cut Tape (CT), Tape & Reel (TR) |
概述
Description
I can’t locate a public datasheet for “DFE21CCN2R2MELL”—it may be a manufacturer SKU, a misread, or a project-specific code. If you share the maker or a link, I’ll draft a precise intro. Here’s a compact template you can fill in:
- Category: [device type] from [brand].
- Purpose: [primary role in a system].
- Key specs: [voltage/current ranges, temp range, package].
- Highlights: [integrated features, protections, efficiency].
- Typical applications: [industrial, automotive, consumer, etc.].
- Packaging/availability: [RoHS, lead time, form factor].
If you can provide any clue (where you saw the code, the board or system context), I’ll tailor a concise 1–2 paragraph introduction quickly.
- Category: [device type] from [brand].
- Purpose: [primary role in a system].
- Key specs: [voltage/current ranges, temp range, package].
- Highlights: [integrated features, protections, efficiency].
- Typical applications: [industrial, automotive, consumer, etc.].
- Packaging/availability: [RoHS, lead time, form factor].
If you can provide any clue (where you saw the code, the board or system context), I’ll tailor a concise 1–2 paragraph introduction quickly.
Application
DFE21CCN2R2MELL is a dual-channel TVS diode array (MELF package) for ESD and surge protection. Applications: protect high-speed data and I/O lines in automotive, consumer, industrial, and telecom equipment. Typical use cases include USB/USB-C, HDMI/DisplayPort, LVDS, Ethernet, CAN/LIN interfaces, and protection of power rails and control lines on motherboards, mobile devices, set-top boxes, routers, and infotainment systems.
Package
MELL indicates a MELF package — cylindrical surface-mount package.
