CYW88373CUBGT

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CYW88373CUBGT

+物料清單

WIRELESS AUTOMOTIVE

  • 製造商英飛淩科技

  • 製造商部分 #CYW88373CUBGT

  • 有存貨6782

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正品保證

規格

屬性 價值
Part Status Active
Base Product Number CYW88373
Packaging Cut Tape (CT), Tape & Reel (TR)

概述

Description

The CYW88373CUBGT is a highly integrated wireless communication module designed by Cypress Semiconductor, now part of Infineon Technologies. It combines Wi-Fi and Bluetooth functionality, making it suitable for a range of IoT applications. The module supports IEEE 802.11ac Wi-Fi standards, providing high-speed network connectivity and enhanced performance. Additionally, it integrates Bluetooth 5.0, which offers improved range, speed, and broadcasting capabilities compared to previous versions.
The CYW88373CUBGT is designed for use in consumer electronics, automotive, and industrial applications, where reliable wireless communication is essential. It supports multiple interfaces, including SDIO and UART, for flexible integration with host processors. The module's small form factor and low power consumption make it ideal for compact and energy-efficient designs.
Developers can leverage robust software and development tools provided by Infineon to facilitate integration and optimize performance. Overall, the CYW88373CUBGT provides developers with a versatile and powerful solution for implementing dual-mode wireless connectivity in their products.

Equivalent

The CYW88373CUBGT chip is a Wi-Fi and Bluetooth combo chip by Infineon Technologies primarily used in IoT applications. Equivalent products include:
1. Broadcom BCM43455: Offers similar Wi-Fi and Bluetooth functionalities.
2. Qualcomm QCA9377: Integrated Wi-Fi and Bluetooth capabilities for IoT devices.
3. Texas Instruments WL1837MOD: A Wi-Fi and Bluetooth combo module.
4. NXP IW416: Offers dual-band Wi-Fi and Bluetooth support.
These alternatives vary slightly in specifications, so ensure compatibility with your specific application requirements.

Features

The CYW88373CUBGT is a highly integrated wireless connectivity solution typically used in mobile devices and other portable electronics. It features dual-band Wi-Fi (802.11ac) and Bluetooth 5.0, providing robust and efficient wireless communication. The chipset supports 2x2 MIMO (Multiple Input, Multiple Output) technology, enhancing Wi-Fi performance and range. It also includes support for MU-MIMO (Multi-User MIMO), which allows for more efficient handling of multiple devices simultaneously.
The Bluetooth 5.0 support offers improved speed and range over previous versions and includes features like enhanced data rates and lower power consumption. The CYW88373CUBGT is designed to be power-efficient, making it suitable for battery-operated devices. It incorporates advanced security protocols to ensure secure data transmission.
The chip is packaged in a compact form factor, facilitating integration into a wide range of devices, including smartphones, tablets, laptops, and IoT devices. Its versatile connectivity options and efficient performance make it a popular choice for manufacturers looking to incorporate advanced wireless capabilities into their products.

Pinout

The CYW88373CUBGT is a wireless communication chip from Infineon, used for Bluetooth and Wi-Fi connectivity. It typically features in mobile devices and IoT applications. While the exact pin count and functions can vary based on the specific package and version, these chips generally come in a compact form factor suited for integration into modern electronic devices.
The exact pin count and detailed pin functions are specified in the datasheet provided by the manufacturer. These datasheets include comprehensive diagrams and tables detailing each pin's role, such as power supply, ground, data interfaces, and control signals for wireless communication functionalities. To get the most accurate and detailed information, it is essential to refer to the specific datasheet for the CYW88373CUBGT, which would be available on Infineon's official website or through their customer support channels.

Manufacturer

The CYW88373CUBGT is manufactured by Infineon Technologies. Infineon is a leading global semiconductor company known for developing, producing, and supplying a wide range of semiconductor solutions. They are recognized for their expertise in automotive, industrial power control, power management and multimarket, and digital security solutions. Infineon's product portfolio includes microcontrollers, sensors, connectivity components, and power semiconductors, catering to applications in automotive, industrial, and consumer electronics sectors.

Application

The CYW88373CUBGT is a versatile wireless communication module that commonly finds application in various areas, including IoT devices, smart home systems, consumer electronics, and automotive applications. Its integration of Wi-Fi and Bluetooth connectivity makes it suitable for applications requiring wireless data transfer, remote device control, or network connectivity. Additionally, it is used in wearables, medical devices, and industrial automation for reliable short-range communication. Its low power consumption and compact design make it ideal for battery-operated devices, enhancing mobility and efficiency in various tech-driven environments.

Package

The CYW88373CUBGT is a wireless connectivity chip that typically comes in a compact BGA (Ball Grid Array) package. This package type is ideal for applications requiring a small form factor and reliable performance in wireless communication, such as in mobile devices and IoT applications.

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