規格
| 屬性 | 價值 |
| Package / Case | Tray |
| Series | EZ-USB CX3 |
| Part Status | Active |
| Applications | USB Host/Peripheral Controller |
| Core Processor | ARM9® |
| Program Memory Type | External Program Memory |
| Controller Series | CYUSB |
| RAM Size | 512K x 8 |
| Interface | GPIF, I²C, I²S, SPI, UART, USB |
| Number of I/O | 12 |
| Voltage - Supply | 1.15V ~ 1.25V |
| Operating Temperature | -40°C ~ 85°C |
| Mounting Type | Surface Mount |
概述
Equivalent
The CYUSB3065-BZXI (EZ-USB CX3) is a USB 3.0 peripheral controller. Equivalent alternatives include:
- FTDI FT60x series (e.g., FT600/601)
- Microchip USB3343 (USB 2.0, but similar functionality)
- Renesas µPD720201/202 (USB 3.0 hub controller)
- Texas Instruments TUSB73x0 (USB 3.0 hub/controller)
These offer similar USB 3.0 interfacing but may vary in features like MIPI CSI-2 support. Check datasheets for exact compatibility.
- FTDI FT60x series (e.g., FT600/601)
- Microchip USB3343 (USB 2.0, but similar functionality)
- Renesas µPD720201/202 (USB 3.0 hub controller)
- Texas Instruments TUSB73x0 (USB 3.0 hub/controller)
These offer similar USB 3.0 interfacing but may vary in features like MIPI CSI-2 support. Check datasheets for exact compatibility.
Pinout
The CYUSB3065-BZXI is a USB 3.0 peripheral controller from Infineon (formerly Cypress).
- Pin Count: 121-pin (BGA package).
- Key Functions:
- USB 3.0/2.0 (5 Gbps) connectivity.
- ARM Cortex-M3 core for embedded processing.
- Supports GPIF II (General Programmable Interface) for flexible external device interfacing (e.g., FPGA, ASIC).
- I2C, SPI, UART for peripheral communication.
- 16-bit/32-bit parallel interface for high-speed data transfer.
- On-chip RAM (512 KB) and ROM (128 KB).
- Programmable firmware for custom applications.
Commonly used in video capture, industrial, and embedded USB applications.
- Pin Count: 121-pin (BGA package).
- Key Functions:
- USB 3.0/2.0 (5 Gbps) connectivity.
- ARM Cortex-M3 core for embedded processing.
- Supports GPIF II (General Programmable Interface) for flexible external device interfacing (e.g., FPGA, ASIC).
- I2C, SPI, UART for peripheral communication.
- 16-bit/32-bit parallel interface for high-speed data transfer.
- On-chip RAM (512 KB) and ROM (128 KB).
- Programmable firmware for custom applications.
Commonly used in video capture, industrial, and embedded USB applications.
Manufacturer
The CYUSB3065-BZXI is manufactured by Cypress Semiconductor, now part of Infineon Technologies after its acquisition in 2020. Infineon is a German semiconductor company specializing in microcontrollers, power management, and connectivity solutions for automotive, industrial, and consumer applications. The CYUSB3065-BZXI is a USB 3.0 hub controller, reflecting Cypress's (now Infineon's) expertise in high-speed interface technologies.
Application
The CYUSB3065-BZXI, a USB 3.0 hub controller by Infineon (formerly Cypress), is widely used in:
1. Industrial PCs & Embedded Systems – For multi-port USB expansion.
2. Docking Stations – Enables high-speed connectivity for laptops/tablets.
3. Medical Devices – Supports data-intensive equipment like imaging systems.
4. Automotive Infotainment – Integrates USB peripherals in vehicles.
5. Gaming Consoles/VR – Enhances peripheral connectivity.
6. Test & Measurement Tools – Facilitates high-speed data transfer.
Its low power, high bandwidth (5 Gbps), and robust ESD protection make it ideal for demanding applications.
1. Industrial PCs & Embedded Systems – For multi-port USB expansion.
2. Docking Stations – Enables high-speed connectivity for laptops/tablets.
3. Medical Devices – Supports data-intensive equipment like imaging systems.
4. Automotive Infotainment – Integrates USB peripherals in vehicles.
5. Gaming Consoles/VR – Enhances peripheral connectivity.
6. Test & Measurement Tools – Facilitates high-speed data transfer.
Its low power, high bandwidth (5 Gbps), and robust ESD protection make it ideal for demanding applications.
Package
The CYUSB3065-BZXI is packaged in a 121-ball BGA (Ball Grid Array) with dimensions of 10 mm x 10 mm. This compact, surface-mount package is designed for high-performance USB 3.0 applications, offering robust thermal and electrical performance. The BGA format ensures efficient space utilization and reliable connectivity for embedded systems.
