BGM123A256V2

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BGM123A256V2

+物料清單

RF TXRX MOD BLUETOOTH CHIP SMD

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正品保證

規格

屬性 價值
Part Status Active
RF Family/Standard Bluetooth
Protocol Bluetooth v4.2
Modulation GFSK
Frequency 2.4GHz
Data Rate 1Mbps
Power - Output 8dBm
Sensitivity -90dBm
Serial Interfaces I2C, I2S, SPI, UART
Antenna Type Integrated, Chip
Utilized IC / Part EFR32BG
Memory Size 256kB Flash, 32kB RAM
Voltage - Supply 1.85V ~ 3.8V
Current - Receiving 9mA
Current - Transmitting 8.2mA
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C
Package / Case 56-SMD Module
Base Product Number BGM123
DigiKey Programmable Not Verified

概述

Description

The BGM123A256V2 is a Bluetooth module from Silicon Labs, designed for low-power wireless communication applications. It integrates a Bluetooth 4.2 low energy (BLE) radio with an ARM Cortex-M4 processor, making it suitable for a wide range of IoT devices. The module is compact and offers robust wireless connectivity with minimal power consumption, making it ideal for battery-operated devices.
Key features include an operating frequency of 2.4 GHz, on-board flash memory, and RAM, providing ample space for custom application development and data storage. It supports a variety of peripherals and interfaces, such as USART, I2C, and SPI, which facilitate easy integration with other hardware components.
The BGM123A256V2 also supports Over-the-Air (OTA) updates, simplifying the process of firmware updates and maintenance. Its design enables easy implementation in space-constrained designs without the need for extensive RF expertise. Overall, the BGM123A256V2 is a versatile solution for developers seeking to implement reliable BLE connectivity in compact, low-power applications.

Equivalent

The BGM123A256V2 is a Bluetooth module from Silicon Labs. Equivalent products include:
1. Nordic Semiconductor's nRF52832, which also supports Bluetooth Low Energy (BLE).
2. TI's CC2640R2F, another BLE-focused microcontroller.
3. Microchip's RN4870, a BLE module with similar functionality.
Each of these alternatives offers comparable BLE capabilities but may differ in specifications such as power consumption, processing power, and peripheral support. Always compare datasheets to ensure compatibility with your project requirements.

Features

The BGM123A256V2 is a system-on-chip module designed for Bluetooth connectivity, integrating several key features. It is built on Silicon Labs' EFR32BG1 Bluetooth Low Energy (BLE) SoC. Key features include:
1. Bluetooth Low Energy (BLE) Support: Supports Bluetooth 5.0 for improved range and data throughput.

2. Microcontroller Unit (MCU): Contains an ARM Cortex-M4 processor with a floating-point unit, offering a good balance of performance and energy efficiency.
3. Memory: Equipped with 256 kB of flash and 32 kB of RAM, providing ample space for code and data.
4. Integrated Antenna: Comes with an onboard antenna, simplifying the design process and reducing the need for external RF components.
5. Low Power Consumption: Optimized for low power, making it suitable for battery-operated devices.
6. Security Features: Includes hardware cryptographic acceleration for secure data communications.
7. Peripheral Interfaces: Supports multiple interfaces, such as UART, SPI, and I2C, for connectivity with other devices.
8. Compact Size: The small form factor makes it ideal for use in space-constrained applications.
These features make the BGM123A256V2 suitable for a variety of IoT applications that require reliable Bluetooth connectivity.

Pinout

The BGM123A256V2 is a module from Silicon Labs that is part of their Blue Gecko Bluetooth module line. This module is specifically designed for Bluetooth Low Energy (BLE) applications. The BGM123A256V2 comes with 32 pins.
Key functions and features include:
1. Bluetooth Low Energy (BLE) 4.2: Supports Bluetooth 4.2 specifications, enabling efficient wireless communication.
2. Microcontroller: Integrated ARM Cortex-M4 processor for efficient processing capabilities.
3. Memory: Comes with 256 kB of Flash memory and 32 kB of RAM.
4. Integrated Antenna: Built-in antenna for simplified design and reduced external component needs.
5. Peripheral Interfaces: Includes GPIO, I2C, SPI, UART, PWM, and ADC interfaces for versatile connectivity options.
6. Low Power Consumption: Designed for low energy usage, suitable for battery-operated devices.
These features make the BGM123A256V2 suitable for a wide range of applications, including wearable devices, health monitors, and other IoT devices requiring efficient, low-power wireless communication.

Manufacturer

The BGM123A256V2 is manufactured by Silicon Labs, also known as Silicon Laboratories Inc. Silicon Labs is a company specializing in the design and development of semiconductors and software for the Internet of Things (IoT) infrastructure, industrial automation, consumer electronics, and automotive markets. They are recognized for producing solutions that include microcontrollers, wireless systems, sensors, and various other integrated circuits that facilitate connectivity and functionality in modern electronic devices. Their products are widely used in various applications requiring low power consumption and high performance.

Application

The BGM123A256V2 is a Bluetooth Low Energy (BLE) module ideal for various IoT and wireless applications. Its application areas include:
1. Wearable Devices: Used in fitness trackers, smartwatches, and health monitors due to its low power consumption.
2. Smart Home: Integrates in devices like smart locks, lights, and thermostats for wireless control and automation.
3. Healthcare: Powers medical devices and remote monitoring systems for efficient health data transmission.
4. Industrial Automation: Facilitates wireless communication in sensors and control systems.
5. Consumer Electronics: Used in remote controls, toys, and other wireless gadgets.
Its compact size and energy efficiency make it suitable for battery-operated devices.

Package

The BGM123A256V2 is a Bluetooth module from Silicon Labs, and it comes in a compact package designed for easy integration into various applications. Specifically, it uses a highly integrated SiP (System in Package) design to deliver a small form factor suitable for space-constrained projects.

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