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BGA2012,115
+物料清單IC RF AMP CDMA 1.9GHZ 6TSSOP
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製造商恩智浦美國股份有限公司。
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製造商部分 #BGA2012,115
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有存貨5514
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正品保證
規格
| 屬性 | 價值 |
| Supplier | NXP USA Inc. |
| Package | Tape & Reel (TR) |
| ProductStatus | Obsolete |
| Frequency | 1.9GHz |
| Gain | 16dB |
| NoiseFigure | 1.7dB |
| RFType | CDMA, DECT, PHS |
| Voltage-Supply | 3V ~ 4.5V |
| Current-Supply | 7.5mA |
| TestFrequency | 1.9GHz |
| MountingType | Surface Mount |
| Package/Case | 6-TSSOP, SC-88, SOT-363 |
概述
Description
However, if hypothetically considering "BGA" as an acronym, it might relate to something like the Ball Grid Array (BGA) in electronics, but "2012,115" would not typically fit into that context. If you have specific details about the subject matter of BGA2012,115, please provide them for a more accurate and tailored response. Alternatively, if BGA2012,115 is a course code, event identifier, or part of a classification system, additional details will help in framing a precise introduction.
Equivalent
Pinout
Key functions of the BGA2012,115 include:
1. Low Noise Amplification: It provides low noise figure amplification, which enhances the overall sensitivity of the receiver.
2. High Gain: The component is designed to offer high gain, enabling effective signal amplification.
3. Broad Frequency Range: It supports a wide frequency range, making it versatile for various RF applications.
Due to its compact 6-pin configuration and efficient performance characteristics, the BGA2012,115 is commonly used in applications like mobile devices, wireless infrastructure, and other RF communication systems.
Manufacturer
Application
1. Consumer Electronics: Smartphones, tablets, laptops, and gaming consoles.
2. Automotive: In-vehicle infotainment systems, navigation, and advanced driver-assistance systems (ADAS).
3. Telecommunications: Network infrastructure and mobile devices.
4. Medical Devices: Portable diagnostic equipment and implantable devices.
5. Industrial Equipment: Robotics and automation systems.
6. Aerospace: Avionics and satellite systems.
Each area benefits from BGA's space efficiency and improved thermal and electrical performance.