圖片僅供參考
規格
| 屬性 | 價值 |
| Manufacturer | JLCPCB Assembly |
| Package | QFN88_10X10mm |
概述
Equivalent
The ASM2806A is a USB 3.0 to SATA bridge chip. Equivalent products include:
- JMicron JMS578
- ASMedia ASM1153E
- VIA VL716
- Renesas uPD720230
These chips offer similar USB 3.0 to SATA bridging functionality and are commonly used in external HDD enclosures or adapters. Choose based on compatibility, performance, and availability.
- JMicron JMS578
- ASMedia ASM1153E
- VIA VL716
- Renesas uPD720230
These chips offer similar USB 3.0 to SATA bridging functionality and are commonly used in external HDD enclosures or adapters. Choose based on compatibility, performance, and availability.
Manufacturer
The ASM2806A is manufactured by ASM Assembly Systems, a subsidiary of ASM Pacific Technology (ASMPT). ASMPT is a global leader in semiconductor and electronics manufacturing equipment, specializing in surface mount technology (SMT), die bonding, and wire bonding solutions. The company serves industries like consumer electronics, automotive, and industrial automation, providing high-precision assembly systems.
ASM Assembly Systems, formerly known as Siemens Electronics Assembly Systems, is recognized for its DEK and SIPLACE brands, offering advanced printing and placement technologies. The ASM2806A is part of their SMT equipment lineup, designed for efficient PCB assembly.
ASMPT is headquartered in Hong Kong and operates worldwide, known for innovation and reliability in semiconductor and electronics manufacturing.
ASM Assembly Systems, formerly known as Siemens Electronics Assembly Systems, is recognized for its DEK and SIPLACE brands, offering advanced printing and placement technologies. The ASM2806A is part of their SMT equipment lineup, designed for efficient PCB assembly.
ASMPT is headquartered in Hong Kong and operates worldwide, known for innovation and reliability in semiconductor and electronics manufacturing.
Package
The ASM2806A is typically available in a QFN-32 (5x5mm) package. This compact, surface-mount design is common for high-performance RF amplifiers, offering efficient thermal dissipation and space-saving benefits. For exact specifications, refer to the manufacturer's datasheet.
