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AS4C1G16D4-062BCN
+物料清單IC DRAM 16GBIT PARALLEL 96FBGA
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製造商Alliance Memory，股份有限公司。
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製造商部分 #AS4C1G16D4-062BCN
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有存貨20778
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規格
| 屬性 | 價值 |
| Part Status | Active |
| Base Product Number | AS4C1G16 |
| Digi Key Programmable | Not Verified |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - DDR4 |
| Memory Size | 16Gbit |
| Memory Organization | 1G x 16 |
| Memory Interface | Parallel |
| Clock Frequency | 1.6 GHz |
| Write Cycle Time - Word, Page | 15ns |
| Voltage - Supply | 1.14V ~ 1.26V |
| Operating Temperature | 0°C ~ 95°C (TC) |
| Mounting Type | Surface Mount |
| Package / Case | 96-TFBGA |
| Supplier Device Package | 96-FBGA (9x13) |
| Packaging | Tray |
| Access Time | 19 ns |
概述
Description
AS4C1G16D4-062BCN is a DDR3 SDRAM memory device (a RAM IC) from Alliance Memory. The part number encodes: 1Gbit density, x16 data width, with D4 indicating its internal organization/format; the -062BCN suffix specifies the speed grade and packaging/temperature options. It is used as external system RAM, interfacing on a standard JEDEC DDR3 bus, typically at around 1.5V. For exact specs—capacity in bytes, timings (CL, tRCD, tRP), maximum frequency, voltage, banks, and package type—consult the official datasheet from Alliance Memory or a distributor.
Features
AS4C1G16D4-062BCN is a DDR4 SDRAM device (Alliance Memory). Key features:
- Density/width: 1 Gb density, x16 data width (1Gbx16)
- Speed: DDR4 data rate up to ≈ 3200 MT/s (speed grade dependent; commonly 2666–3200)
- Architecture: 16 banks (2 bank groups), 8n prefetch
- Voltage: typically 1.2 V VDD/VDDQ
- Synchronous, self-timing with the clock
- Features: Auto-Refresh, Deep Power-Down/Partial Array Self-Refresh, On-Die Termination (ODT), DLL for timing
- Packaging: DDR4 device suitable for memory modules or similar PCB implementations (RoHS-compliant)
- Operating range: industrial/consumer grade options (temperature ranges vary by part)
Note: Exact speed grade, timing, and package details depend on the specific device revision; refer to the datasheet for precise specs.
- Density/width: 1 Gb density, x16 data width (1Gbx16)
- Speed: DDR4 data rate up to ≈ 3200 MT/s (speed grade dependent; commonly 2666–3200)
- Architecture: 16 banks (2 bank groups), 8n prefetch
- Voltage: typically 1.2 V VDD/VDDQ
- Synchronous, self-timing with the clock
- Features: Auto-Refresh, Deep Power-Down/Partial Array Self-Refresh, On-Die Termination (ODT), DLL for timing
- Packaging: DDR4 device suitable for memory modules or similar PCB implementations (RoHS-compliant)
- Operating range: industrial/consumer grade options (temperature ranges vary by part)
Note: Exact speed grade, timing, and package details depend on the specific device revision; refer to the datasheet for precise specs.
Pinout
- Pin count: 62 pins (62-ball BGA package)
- Function: 1-Gbit, x16-wide memory device (RAM/DRAM) from Alliance Memory; provides a 16-bit data bus with standard address/command/control signals plus power/GND.
- Function: 1-Gbit, x16-wide memory device (RAM/DRAM) from Alliance Memory; provides a 16-bit data bus with standard address/command/control signals plus power/GND.
Manufacturer
- Manufacturer: Alliance memory, Inc.
- What kind of company: A fabless semiconductor company that designs, develops, and markets memory ICs (such as SRAM and DRAM) for automotive, industrial, and consumer applications.
- What kind of company: A fabless semiconductor company that designs, develops, and markets memory ICs (such as SRAM and DRAM) for automotive, industrial, and consumer applications.
Application
AS4C1G16D4-062BCN is a DRAM memory component. Typical application areas include:
- Mobile and embedded devices (smartphones, tablets, wearable devices)
- Automotive electronics (infotainment, instrument clusters, telematics)
- Consumer electronics (digital cameras, TVs, set‑top boxes, game consoles)
- Industrial and IoT (edge gateways, industrial PCs, sensors, robotics)
- Networking and data centers (servers, switches, caching memory)
Note: exact usage depends on the device’s memory type (LPDDR/DDR), capacity, and speed grade.
- Mobile and embedded devices (smartphones, tablets, wearable devices)
- Automotive electronics (infotainment, instrument clusters, telematics)
- Consumer electronics (digital cameras, TVs, set‑top boxes, game consoles)
- Industrial and IoT (edge gateways, industrial PCs, sensors, robotics)
- Networking and data centers (servers, switches, caching memory)
Note: exact usage depends on the device’s memory type (LPDDR/DDR), capacity, and speed grade.
Package
Package: 8-pin SOP (surface-mount Small Outline Package).
