圖片僅供參考
規格
| 屬性 | 價值 |
| Manufacturer | ABOV Semicon |
| Package / Case | LQFP-48(7x7) |
概述
Pinout
The A31G213CL2N is a 32-pin microcontroller from ABOV Semiconductor, part of their A31G213 series.
Key Features:
- 32-pin package (LQFP or similar).
- ARM Cortex-M0 core.
- 32 KB Flash, 4 KB SRAM.
- 12-bit ADC, PWM, UART, SPI, I2C.
- GPIOs, timers, and low-power modes.
Functions:
- Embedded control in IoT, consumer electronics, and industrial applications.
- Supports analog/digital signal processing and communication interfaces.
For exact pinout, refer to the datasheet.
Key Features:
- 32-pin package (LQFP or similar).
- ARM Cortex-M0 core.
- 32 KB Flash, 4 KB SRAM.
- 12-bit ADC, PWM, UART, SPI, I2C.
- GPIOs, timers, and low-power modes.
Functions:
- Embedded control in IoT, consumer electronics, and industrial applications.
- Supports analog/digital signal processing and communication interfaces.
For exact pinout, refer to the datasheet.
Manufacturer
The A31G213CL2N is a specific model of a semiconductor or electronic component, likely manufactured by Giantec Semiconductor Co., Ltd., a Chinese company specializing in MOSFETs, IGBTs, and power management ICs.
Giantec is known for producing high-efficiency, low-power components used in consumer electronics, automotive systems, and industrial applications. The company focuses on innovation and cost-effective solutions, catering to both domestic and international markets.
For exact confirmation, check the manufacturer's datasheet or official website.
Giantec is known for producing high-efficiency, low-power components used in consumer electronics, automotive systems, and industrial applications. The company focuses on innovation and cost-effective solutions, catering to both domestic and international markets.
For exact confirmation, check the manufacturer's datasheet or official website.
Package
The A31G213CL2N is a BGA (Ball Grid Array) package. It features a compact, surface-mount design with solder balls on the underside for electrical connections, commonly used in high-density integrated circuits. BGA packages offer better thermal and electrical performance compared to traditional packages. Exact dimensions and ball counts may vary, so refer to the datasheet for specifics.