TLV3501AIDBVT vs TLV3541IDBVR

對 TLV3501AIDBVT 和 TLV3541IDBVR 的深入比較，為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素，包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異，簡化了元件選擇，讓您更輕鬆地為您的特定應用選擇最佳方案。

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification TLV3501AIDBVT TLV3541IDBVR
Part Status Active Active
Type General Purpose -
Number of Elements 1 -
Output Type CMOS, Push-Pull, Rail-to-Rail, TTL Rail-to-Rail
Voltage - Supply, Single/Dual (±) 2.7V ~ 5.5V, ±1.35V ~ 2.75V -
Voltage - Input Offset (Max) 6.5mV @ 5.5V -
Current - Input Bias(Max) 10pA @ 5.5V -
Current - Quiescent (Max) 5mA -
CMRRPSRR(Typ) 70dB CMRR, 100dB PSRR -
Propagation Delay(Max) 10ns -
Hysteresis 6mV -
Operating Temperature -40°C ~ 125°C -40°C ~ 125°C
Mounting Type Surface Mount Surface Mount
Amplifier Type - General Purpose
Number of Circuits - 1
Slew Rate - 150V/µs
Gain Bandwidth Product - 100 MHz
-3 dB Bandwidth - 200 MHz
Current - Input Bias - 3 pA
Voltage - Input Offset - 2 mV
Supply Current - 5.2mA
Current - Output / Channel - 100 mA
Voltage - Supply Span(Min) - 2.5 V
Voltage - Supply Span(Max) - 5.5 V
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