MPC870VR66 vs MPC875CVR133

對 MPC870VR66 和 MPC875CVR133 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MPC870VR66

恩智浦美國股份有限公司。

Lifecycle
Active
Stock
621 件
Package
BBGA-256
Series
嵌入式微處理器
Part B

MPC875CVR133

恩智浦美國股份有限公司。

Lifecycle
Active
Stock
7171 件
Package
BBGA-256
Series
嵌入式微處理器

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MPC870VR66 MPC875CVR133
Supplier Rochester Electronics, LLC,NXP USA Inc. NXP USA Inc.
Series MPC8xx MPC8xx
Part Status Obsolete Obsolete
Core Processor MPC8xx MPC8xx
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 66MHz 133MHz
Co - Processors / DSP Communications; CPM Communications; CPM, Security; SEC
RAM Controllers DRAM DRAM
Graphics Acceleration No No
Ethernet 10/100Mbps (2) 10Mbps (1), 10/100Mbps (2)
USB USB 2.0 (1) USB 2.0 (1)
Voltage - I / O 3.3V 3.3V
Operating Temperature 0°C ~ 95°C (TA) -40°C ~ 100°C (TA)
Security Features - Cryptography