Part A
MPC860TVR50D4
恩智浦美國股份有限公司。
- Lifecycle
- Active
- Stock
- 2566 件
- Package
- BGA-357
- Series
- 嵌入式微處理器
對 MPC860TVR50D4 和 MPC860DPVR80D4 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。
恩智浦美國股份有限公司。
飛思卡爾電晶體
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | MPC860TVR50D4 | MPC860DPVR80D4 |
|---|---|---|
| Supplier | - | Rochester Electronics, LLC |
| Series | MPC8xx | MPC86xx |
| Part Status | Obsolete | Active |
| Core Processor | MPC8xx | MPC8xx |
| Number of Cores / Bus Width | 1 Core, 32-Bit | 1 Core, 32-Bit |
| Speed | 50MHz | 80MHz |
| Co - Processors / DSP | Communications; CPM | Communications; CPM |
| RAM Controllers | DRAM | DRAM |
| Graphics Acceleration | No | No |
| Ethernet | 10Mbps (4), 10/100Mbps (1) | 10Mbps (2), 10/100Mbps (1) |
| Voltage - I / O | 3.3V | 3.3V |
| Operating Temperature | 0°C ~ 95°C (TA) | 0°C ~ 95°C (TJ) |