Part A
MPC860ENCVR50D4
恩智浦美國股份有限公司。
- Lifecycle
- Active
- Stock
- 5429 件
- Package
- SOT1666-1
- Series
- 嵌入式微處理器
對 MPC860ENCVR50D4 和 MPC860TZQ66D4 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。
恩智浦美國股份有限公司。
飛思卡爾電晶體
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | MPC860ENCVR50D4 | MPC860TZQ66D4 |
|---|---|---|
| Supplier | - | Rochester Electronics, LLC |
| Part Status | Obsolete | Active |
| Series | MPC8xx | - |
| Core Processor | MPC8xx | - |
| Number of Cores / Bus Width | 1 Core, 32-Bit | - |
| Speed | 50MHz | - |
| Co - Processors / DSP | Communications; CPM | - |
| RAM Controllers | DRAM | - |
| Graphics Acceleration | No | - |
| Ethernet | 10Mbps (4) | - |
| Voltage - I / O | 3.3V | - |
| Operating Temperature | -40°C ~ 95°C (TA) | - |