MPC850DEZQ50BU vs MPC852TVR66

對 MPC850DEZQ50BU 和 MPC852TVR66 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part B

MPC852TVR66

恩智浦美國股份有限公司。

Lifecycle
Active
Stock
4861 件
Package
BBGA-256
Series
嵌入式微處理器

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MPC850DEZQ50BU MPC852TVR66
Supplier - NXP USA Inc.
Series MPC8xx MPC8xx
Part Status Obsolete Obsolete
Core Processor MPC8xx MPC8xx
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 50MHz 66MHz
Co - Processors / DSP Communications; CPM Communications; CPM
RAM Controllers DRAM DRAM
Graphics Acceleration No No
Ethernet 10Mbps (1) 10Mbps (1)
Voltage - I / O 3.3V 3.3V
Operating Temperature 0°C ~ 95°C (TA) 0°C ~ 95°C (TA)
USB USB 1.x (1) -