MC9S08FL16CBM vs MC9S08SE8MRL

對 MC9S08FL16CBM 和 MC9S08SE8MRL 的深入比較，為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素，包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異，簡化了元件選擇，讓您更輕鬆地為您的特定應用選擇最佳方案。

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part B

MC9S08SE8MRL

恩智浦美國股份有限公司。

Lifecycle
Active
Stock
9568 件
Package
DIP-28
Series
嵌入式-微控制器
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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC9S08FL16CBM MC9S08SE8MRL
Supplier - NXP USA Inc.
Series S08 S08
Part Status Obsolete Obsolete
Core Processor S08 S08
Core Size 8-Bit 8-Bit
Speed 20MHz 20MHz
Connectivity SCI LINbus, SCI
Peripherals LVD, PWM, WDT LVD, POR, PWM
Number of I/O 30 24
Program Memory Size 16KB (16K x 8) 8KB (8K x 8)
Program Memory Type FLASH FLASH
RAM Size 1K x 8 512 x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 12x8b A/D 10x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Mounting Type Through Hole Through Hole
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