Part A
MC56F8355VFGE
飛思卡爾電晶體
- Lifecycle
- Active
- Stock
- 5258 件
- Package
- LQFP-128
- Series
- 嵌入式-微控制器
對 MC56F8355VFGE 和 MC56F8013MFAE 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。
飛思卡爾電晶體
恩智浦美國股份有限公司。
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | MC56F8355VFGE | MC56F8013MFAE |
|---|---|---|
| Supplier | - | NXP USA Inc. |
| Series | 56F8xxx | 56F8xxx |
| Part Status | Active | Active |
| Core Processor | 56800E | 56800E |
| Core Size | 16-Bit | 16-Bit |
| Speed | 60MHz | 32MHz |
| Connectivity | CANbus, EBI/EMI, SCI, SPI | I²C, SCI, SPI |
| Peripherals | POR, PWM, Temp Sensor, WDT | POR, PWM, WDT |
| Number of I/O | 49 | 26 |
| Program Memory Size | 256KB (128K x 16) | 16KB (8K x 16) |
| Program Memory Type | FLASH | FLASH |
| RAM Size | 10K x 16 | 2K x 16 |
| Voltage - Supply (Vcc/Vdd) | 2.25V ~ 3.6V | 3V ~ 3.6V |
| Data Converters | A/D 16x12b | A/D 6x12b |
| Oscillator Type | External | Internal |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 125°C (TA) |
| Mounting Type | Surface Mount | Surface Mount |