MC56F8323VFBE vs MC56F8257MLH

對 MC56F8323VFBE 和 MC56F8257MLH 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC56F8323VFBE MC56F8257MLH
Supplier - Rochester Electronics, LLC
Series 56F8xxx Bulk
Part Status Not For New Designs 56F8xxx
Core Processor 56800E Active
Core Size 16-Bit 56800E
Speed 60MHz 16-Bit
Connectivity CANbus, SCI, SPI 60MHz
Peripherals POR, PWM, Temp Sensor, WDT CANbus, I²C, LINbus, SCI, SPI
Number of I/O 27 LVD, POR, PWM, WDT
Program Memory Size 32KB (16K x 16) 54
Program Memory Type FLASH 64KB (32K x 16)
EEPROM Size - FLASH
Voltage - Supply (Vcc/Vdd) 2.25V ~ 3.6V 4K x 16
Data Converters A/D 8x12b 3V ~ 3.6V
Oscillator Type Internal A/D 16x12b; D/A 1x12b
Operating Temperature -40°C ~ 105°C (TA) Internal
Mounting Type Surface Mount -40°C ~ 125°C (TA)
RAM Size 12K x 8 -