HD64F3062BFBL25V vs HD64F3684GDV

對 HD64F3062BFBL25V 和 HD64F3684GDV 的深入比較，為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素，包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異，簡化了元件選擇，讓您更輕鬆地為您的特定應用選擇最佳方案。

Technical review by ETEI Component Engineering Source: manufacturer documentation

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification HD64F3062BFBL25V HD64F3684GDV
Supplier - Renesas Electronics America Inc
Series H8® H8/300H H8® H8/300H Tiny
Part Status Obsolete Active
Core Processor H8/300H H8/300H
Core Size 16-Bit 16-Bit
Speed 25MHz 20MHz
Connectivity SCI, SmartCard I²C, SCI
Peripherals DMA, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 70 45
Program Memory Size 128KB (128K x 8) 32KB (32K x 8)
Program Memory Type FLASH FLASH
RAM Size 4K x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V 3V ~ 5.5V
Data Converters A/D 8x10b; D/A 2x8b A/D 8x10b
Oscillator Type Internal Internal
Operating Temperature -20°C ~ 75°C (TA) -20°C ~ 75°C (TA)
Mounting Type Surface Mount Surface Mount
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