Part A
EPM2210F256C3N
訊息
- Lifecycle
- Active
- Stock
- 1647 件
- Package
- FBGA-256
- Series
- 嵌入式-CPLD(複雜可程式設計邏輯器件)
對 EPM2210F256C3N 和 EPM2210F324C4 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。
訊息
訊息
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | EPM2210F256C3N | EPM2210F324C4 |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® II | MAX® II |
| Part Status | Active | Active |
| Programmable Type | In System Programmable | In System Programmable |
| Delay Timetpd(1)Max | 7 ns | 7 ns |
| Voltage Supply - Internal | 2.5V, 3.3V | 2.5V, 3.3V |
| Number of Logic Elements/Blocks | 2210 | 2210 |
| Number of Macrocells | 1700 | 1700 |
| Number of I/O | 204 | 272 |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
| Mounting Type | Surface Mount | Surface Mount |