DSP56321VF275 vs DSP56303VF100R2

對 DSP56321VF275 和 DSP56303VF100R2 的深入比較，為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素，包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異，簡化了元件選擇，讓您更輕鬆地為您的特定應用選擇最佳方案。

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

DSP56321VF275

恩智浦美國股份有限公司。

Lifecycle
Active
Stock
8786 件
Package
BGA-196
Series
嵌入式-DSP（數位信號處理器）
+物料清單 詢價
Part B

DSP56303VF100R2

恩智浦美國股份有限公司。

Lifecycle
Active
Stock
3864 件
Package
LBGA-196
Series
嵌入式-DSP（數位信號處理器）
+物料清單 詢價

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification DSP56321VF275 DSP56303VF100R2
Supplier Rochester Electronics, LLC,NXP USA Inc. NXP USA Inc.
Series DSP56K/Symphony DSP563xx
Part Status Last Time Buy Obsolete
Type Fixed Point Fixed Point
Interface Host Interface, SSI, SCI Host Interface, SSI, SCI
Clock Rate 275MHz 100MHz
Non - Volatile Memory ROM (576B) ROM (576B)
On - Chip RAM 576kB 24kB
Voltage - I / O 3.30V 3.30V
Voltage - Core 1.60V 3.30V
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Mounting Type Surface Mount Surface Mount
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