DSP56303AG100 vs DSP56853FGE

對 DSP56303AG100 和 DSP56853FGE 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

DSP56303AG100

恩智浦美國股份有限公司。

Lifecycle
Active
Stock
2147 件
Package
LQFP-144
Series
嵌入式-DSP(數位信號處理器)
Part B

DSP56853FGE

恩智浦美國股份有限公司。

Lifecycle
Active
Stock
8458 件
Package
LQFP-128
Series
嵌入式-微控制器

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification DSP56303AG100 DSP56853FGE
Supplier - NXP USA Inc.
Series DSP563xx 568xx
Part Status Obsolete Obsolete
Core Processor - 56800E
Core Size - 16-Bit
Speed - 120MHz
Connectivity - EBI/EMI, SCI, SPI, SSI
Peripherals - DMA, POR, WDT
Number of I/O - 41
Program Memory Size - 24KB (12K x 16)
Program Memory Type - SRAM
RAM Size - 4K x 16
Voltage - Supply (Vcc/Vdd) - 1.62V ~ 1.98V
Oscillator Type - External
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Type Fixed Point -
Interface Host Interface, SSI, SCI -
Clock Rate 100MHz -
Non - Volatile Memory ROM (576B) -
On - Chip RAM 24kB -
Voltage - I / O 3.30V -
Voltage - Core 3.30V -