Part A
AM5716AABCX
德州儀器
- Lifecycle
- Active
- Stock
- 6625 件
- Series
- 嵌入式微處理器
Replacement verdict
Compatible functional replacement candidate
The AM5718AABCXA is a higher-tier superset device within the same Sitara AM571x family and shares the identical ABC package footprint, pinout, and core architecture as the AM5716AABCX, making it a viable functional upgrade candidate. The primary distinction is the added dual-core DSP subsystem and vision acceleration present on the AM5718, which the AM5716 omits; designers must validate power budget, thermal envelope, and software configuration before substituting in existing AM5716AABCX designs.
Package and Pinout
High match
CPU Core Architecture
High match
DSP Subsystem
Validation required
Power and Thermal
Validation required
Parts at a glance
Part B
AM5718AABCXA
德州儀器
- Lifecycle
- Active
- Stock
- 3954 件
- Package
- FCBGA-760
- Series
- 嵌入式微處理器
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | AM5716AABCX | AM5718AABCXA | Why it matters |
|---|---|---|---|
| Arm CPU Cores | 1x Arm Cortex-A15 | 2x Arm Cortex-A15 | The number of Cortex-A15 cores determines multitasking and application processing throughput; a dual-core device can run more concurrent workloads than a single-core one. |
| DSP Cores | 1x C66x DSP | 2x C66x DSP | The C66x DSP count affects real-time signal-processing capacity; two DSPs provide roughly double the fixed/floating-point DSP throughput for vision, audio, and control algorithms. |
| Maximum Arm Clock Frequency | 1.5 GHz | 1.5 GHz | The Cortex-A15 clock rate sets peak application-processing performance; both parts share the same per-core frequency, so per-core speed is equivalent. |
| On-chip SRAM | 2.5 MB | 2.5 MB | On-chip SRAM (OCMC) provides fast scratchpad memory for DSP and shared buffers; identical capacity means the same memory budget for tight-loop and shared data. |
| Package | FCBGA (ABC), 760 balls | FCBGA (ABC), 760 balls | Package and ball count determine PCB footprint and pinout compatibility; matching packages allow the same board layout to be reused. |
| Operating Temperature Range | -40°C to +105°C (industrial) | -40°C to +105°C (industrial) | The temperature grade defines the environments where the device can be reliably deployed; identical industrial ratings mean equivalent environmental robustness. |
| Ethernet / Industrial Protocols | 2x Gigabit Ethernet, PRU-ICSS | 2x Gigabit Ethernet, PRU-ICSS | Integrated Gigabit Ethernet and PRU-ICSS support real-time industrial protocols (EtherCAT, PROFINET); identical networking blocks preserve connectivity options. |
| Display Subsystem | 1x display subsystem (LCD) | 1x display subsystem (LCD) | The display subsystem enables HMI and video output; matching capability means the same graphics use cases are supported. |
| 3D Graphics Accelerator | Not included | Not included | A dedicated 3D GPU offloads rendering from the CPU; neither part integrates one, so graphics workloads rely on the CPU/DSP in both cases. |
| Product Status / Longevity | Active | Active | Both parts are in active production, so supply continuity and long-term availability are comparable for design-in decisions. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | AM5716AABCX | AM5718AABCXA |
|---|---|---|
| Series | Sitara™ | Sitara™ |
| Part Status | Active | Active |
| Core Processor | ARM® Cortex®-A15 | ARM® Cortex®-A15 |
| Number of Cores / Bus Width | 1 Core, 32-Bit | 1 Core, 32-Bit |
| Speed | 1.5GHz | 1.5GHz |
| Co - Processors / DSP | Multimedia; GPU, IPU, VFP | Multimedia; GPU, IPU, VFP |
| RAM Controllers | DDR3, SRAM | DDR3, SRAM |
| Graphics Acceleration | No | Yes |
| Display&Interface Controllers | - | HDMI |
| Ethernet | 10/100/1000Mbps (1) | 10/100/1000Mbps (1) |
| SATA | SATA 3Gbps (1) | SATA 3Gbps (1) |
| USB | USB 2.0 (1), USB 3.0 (1) | USB 2.0 (1), USB 3.0 (1) |
| Voltage - I / O | 1.8V, 3.3V | 1.8V, 3.3V |
| Operating Temperature | 0°C ~ 90°C (TJ) | -40°C ~ 105°C (TJ) |
| Base Product Number | AM5716 | - |
| Mounting Type | Surface Mount | - |
| Additional Interfaces | CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | - |
| Packaging | Tray | - |
Frequently asked questions
What is the primary difference between the AM5716AABCX and the AM5718AABCXA?
The AM5716AABCX is a Sitara AM5716 processor featuring a single Arm Cortex-A15 core and dual Arm Cortex-M4 cores, while the AM5718AABCXA is a Sitara AM5718 device with dual Arm Cortex-A15 cores and dual Arm Cortex-M4 cores. The AM5718AABCXA also includes additional industrial communication peripherals such as dual PRU-ICSS subsystems, making it suited for higher-throughput multi-protocol applications.
Are the AM5716AABCX and AM5718AABCXA pin-to-pin compatible?
Both devices are offered in the same FCBGA (ABC) package with a 0.8 mm pitch and 760 balls, and they share a common Sitara AM57x pinout architecture. However, because the AM5718AABCXA exposes additional interfaces (such as the second PRU-ICSS and additional Ethernet ports), designers must verify the specific ball functions against the respective datasheets before treating them as drop-in replacements.
Do both devices support the same operating temperature range?
Yes. Both the AM5716AABCX and AM5718AABCXA are rated for the industrial temperature range of -40°C to +105°C (junction temperature), as specified in the Texas Instruments Sitara AM571x/AM572x datasheets for the ABC package suffix.
What memory and peripheral interfaces do these processors support?
Both devices integrate DDR3/DDR3L memory controllers, dual Gigabit Ethernet MACs, USB 3.0 and USB 2.0 ports, PCIe Gen2, SATA, and multiple UART, SPI, and I2C interfaces. The AM5718AABCXA additionally provides a second PRU-ICSS subsystem and extra industrial Ethernet capability compared to the AM5716AABCX.
Can the AM5716AABCX be used as a lower-cost alternative to the AM5718AABCXA?
The AM5716AABCX can serve as a cost-reduced option when the application does not require dual Cortex-A15 cores or the second PRU-ICSS subsystem. Designers must confirm that the reduced core count and peripheral set meet the processing and real-time communication requirements of the target application before substituting.
What software and development tools are available for both devices?
Both processors are supported by the Texas Instruments Processor SDK for Sitara AM57x devices, which includes Linux and RTOS support, Code Composer Studio, and the PinMux and Clock Tree tools. The same SDK and evaluation module ecosystem applies to both the AM5716AABCX and AM5718AABCXA.
Are both devices suitable for industrial communication protocols such as EtherCAT and PROFINET?
Yes. Both devices include PRU-ICSS subsystems that enable industrial protocols such as EtherCAT, PROFINET, EtherNet/IP, and POWERLINK through TI's industrial software stacks. The AM5718AABCXA offers dual PRU-ICSS instances, allowing simultaneous support of more protocol channels than the single-instance AM5716AABCX.