AM3352BZCZ80 vs AM3352ZCED50

對 AM3352BZCZ80 和 AM3352ZCED50 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The AM3352BZCZ80 and AM3352ZCED50 are both Sitara AM335x Arm Cortex-A8 microprocessors sharing the same core architecture, peripheral set, and 15x15 mm NFBGA-324 package, making them functionally interchangeable for most designs. The primary distinction is the operating temperature range: the AM3352BZCZ80 is rated for the commercial/industrial 0°C to 90°C range, while the AM3352ZCED50 is rated for the extended -40°C to 105°C range. Designers should confirm that the target application's thermal envelope and clock requirements align with the selected variant before committing to a drop-in substitution.

Core Architecture High match
Package Type High match
Operating Temperature Validation required
Max Clock Frequency Validation required

Parts at a glance

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter AM3352BZCZ80 AM3352ZCED50 Why it matters
Core Processor ARM Cortex-A8 ARM Cortex-A8 Both use the same ARM Cortex-A8 core, so instruction set and software compatibility are identical.
Maximum Clock Frequency 800 MHz 500 MHz The higher-frequency part delivers more processing throughput; a drop-in replacement must meet the timing budget of the target application.
Operating Temperature Range -40°C to +85°C (industrial) -40°C to +105°C (extended) The extended-temperature variant supports harsher environments; substituting a lower-rated part may violate thermal requirements.
Package / Case 324-LFBGA (15x15) 298-NFBGA (13x13) Different package footprints and ball counts require different PCB layouts, so they are not physically drop-in compatible.
Number of I/O Pins Up to 114 GPIO Up to 114 GPIO Matching GPIO availability ensures peripheral connectivity can be preserved across designs.
On-Chip RAM 64 KB SRAM 64 KB SRAM Identical internal SRAM supports the same boot and buffer usage without firmware changes.
Supply Voltage 1.1 V core (1.06–1.15 V) 1.1 V core (1.06–1.15 V) Same core voltage rails allow reuse of the existing power design and sequencing.
Ethernet / Peripherals 2x Gigabit Ethernet, USB, CAN, UART, SPI, I2C 2x Gigabit Ethernet, USB, CAN, UART, SPI, I2C Identical peripheral set preserves connectivity and interface compatibility for the application.
Product Status Active Active Both are in active production, ensuring long-term availability for new and existing designs.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification AM3352BZCZ80 AM3352ZCED50
Supplier - Rochester Electronics, LLC,Texas Instruments
Series Sitara™ Sitara™
Part Status Active Obsolete
Core Processor ARM® Cortex®-A8 ARM® Cortex®-A8
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 800MHz 500MHz
Co - Processors / DSP Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD
RAM Controllers LPDDR, DDR2, DDR3, DDR3L LPDDR, DDR2, DDR3, DDR3L
Graphics Acceleration Yes Yes
Display&Interface Controllers LCD, Touchscreen LCD, Touchscreen
Ethernet 10/100/1000Mbps (2) 10/100/1000Mbps (2)
USB USB 2.0 + PHY (2) USB 2.0 + PHY (2)
Voltage - I / O 1.8V, 3.3V 1.8V, 3.3V
Operating Temperature 0°C ~ 90°C (TJ) -40°C ~ 90°C (TJ)
Security Features Cryptography, Random Number Generator Cryptography, Random Number Generator

Frequently asked questions

What are the key differences between the AM3352BZCZ80 and the AM3352ZCED50?

The AM3352BZCZ80 is a Sitara AM335x ARM Cortex-A8 microprocessor operating at 800 MHz in a 324-ball PBGA (ZCZ) package with a commercial temperature range of 0°C to 90°C. The AM3352ZCED50 operates at 500 MHz in a 298-ball PBGA (ZCE) package with an extended temperature range of -40°C to 90°C. The primary differences are operating frequency, package footprint, and temperature grade.

Are the AM3352BZCZ80 and AM3352ZCED50 pin-to-pin compatible?

No. The AM3352BZCZ80 uses the 324-ball ZCZ package, while the AM3352ZCED50 uses the 298-ball ZCE package. These are different package footprints with different ball counts and PCB land patterns, so they are not drop-in replacements for each other.

What is the operating temperature range of each device?

The AM3352BZCZ80 is rated for the commercial temperature range of 0°C to 90°C (junction temperature). The AM3352ZCED50 is rated for the extended temperature range of -40°C to 90°C, making it suitable for industrial and outdoor applications requiring sub-zero operation.

What ARM core and clock speed does each processor use?

Both devices are based on the ARM Cortex-A8 core within the Sitara AM335x family. The AM3352BZCZ80 runs at 800 MHz, while the AM3352ZCED50 runs at 500 MHz. The higher frequency of the AM3352BZCZ80 provides greater processing throughput for performance-sensitive designs.

Can the AM3352ZCED50 be used as a substitute for the AM3352BZCZ80 in an existing design?

Not directly. Substitution requires a PCB redesign because the 298-ball ZCE package of the AM3352ZCED50 differs from the 324-ball ZCZ package of the AM3352BZCZ80. Additionally, the lower 500 MHz clock and different temperature grade must be validated against the target application's performance and environmental requirements using the respective TI datasheets.

Which device is better suited for industrial temperature environments?

The AM3352ZCED50 is better suited for industrial environments because its extended temperature range of -40°C to 90°C supports operation below freezing. The AM3352BZCZ80's commercial 0°C to 90°C range is intended for controlled-environment applications.

Do both devices share the same Sitara AM335x peripheral set?

Both are members of the Texas Instruments Sitara AM335x family and share the same Cortex-A8 architecture and peripheral IP blocks, including interfaces such as UART, I2C, SPI, and Ethernet MAC. However, exact peripheral availability and pin multiplexing must be confirmed against the specific package pinout in the respective TI datasheets, since the ZCZ and ZCE packages expose different ball counts.