AM1802EZWTD3
德州儀器
- Lifecycle
- Active
- Stock
- 3390 件
- Package
- NFBGA-361
- Series
- 嵌入式微處理器
對 AM1802EZWTD3 和 AM1806BZCEA3 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。
Replacement verdict
The AM1806BZCEA3 is a viable functional replacement candidate for the AM1802EZWTD3, sharing the same ARM926EJ-S core architecture and comparable peripheral integration, though the differing package, speed grade, and operating temperature range require validation against the target application's mechanical and thermal requirements before substitution.
德州儀器
德州儀器
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | AM1802EZWTD3 | AM1806BZCEA3 | Why it matters |
|---|---|---|---|
| Core Architecture | ARM926EJ-S (ARM9) | ARM926EJ-S (ARM9) | Both use the same ARM9 core, so instruction set and toolchain compatibility are preserved. |
| Maximum Clock Frequency | 300 MHz | 456 MHz | Higher clock speed in the AM1806 provides more processing headroom for compute-intensive tasks. |
| On-Chip RAM | 8 KB | 128 KB | Larger on-chip RAM reduces external memory needs and improves performance for buffering and code execution. |
| Package / Pin Count | 361-ball NFBGA (ZWT) | 361-ball NFBGA (ZCE) | Package footprint and ballout affect PCB layout and whether a drop-in replacement is possible. |
| Operating Temperature Range | -40°C to +90°C (extended) | -40°C to +85°C (industrial) | Temperature range determines suitability for harsh or industrial environments. |
| USB Support | USB 2.0 High-Speed OTG | USB 2.0 High-Speed OTG | Both support USB OTG, enabling host/device connectivity for peripherals and data transfer. |
| Ethernet MAC | 10/100 Mbps EMAC | 10/100 Mbps EMAC | Integrated Ethernet MAC supports networked applications without external controllers. |
| LCD Controller | Not available | Integrated LCD controller | The AM1806 can drive displays directly, while the AM1802 requires external display logic. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Matching core voltage simplifies power supply design and compatibility. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | AM1802EZWTD3 | AM1806BZCEA3 |
|---|---|---|
| Supplier | - | Rochester Electronics, LLC,Texas Instruments |
| Series | Sitara™ | Sitara™ |
| Part Status | Active | Obsolete |
| Core Processor | ARM926EJ-S | ARM926EJ-S |
| Number of Cores / Bus Width | 1 Core, 32-Bit | 1 Core, 32-Bit |
| Speed | 300MHz | 375MHz |
| Co - Processors / DSP | System Control; CP15 | System Control; CP15 |
| RAM Controllers | LPDDR, DDR2 | LPDDR, DDR2 |
| Graphics Acceleration | No | No |
| Display&Interface Controllers | LCD | LCD |
| USB | USB 2.0 + PHY (1) | USB 2.0 + PHY (1) |
| Voltage - I / O | 1.8V, 3.3V | 1.8V, 3.3V |
| Operating Temperature | -40°C ~ 90°C (TJ) | -40°C ~ 105°C (TJ) |
| Ethernet | 10/100Mbps (1) | - |
The AM1802EZWTD3 is an ARM926EJ-S based Sitara processor in a 361-ball NFBGA (ZWT) package, while the AM1806BZCEA3 is an ARM926EJ-S based Sitara processor in a 361-ball NFBGA (ZCE) package. Both are members of the AM180x family, but they differ in package ball-out, operating temperature grade, and specific peripheral configuration. The AM1802EZWTD3 is specified for the extended commercial temperature range, whereas the AM1806BZCEA3 is specified for the industrial temperature range. Designers must consult the respective datasheets for exact peripheral and pin-mux differences.
No. Although both devices use a 361-ball NFBGA package, the AM1802EZWTD3 uses the ZWT ball-out and the AM1806BZCEA3 uses the ZCE ball-out. These are distinct package designators with different pin assignments and signal muxing, so they are not drop-in replacements. A PCB redesign or re-layout is required when migrating between them.
The AM1802EZWTD3 is rated for the extended commercial temperature range (typically 0°C to 90°C case temperature, per the AM180x datasheet). The AM1806BZCEA3 is rated for the industrial temperature range (typically -40°C to 90°C case temperature). The industrial-grade AM1806BZCEA3 is therefore the appropriate choice for applications exposed to sub-zero or harsh environments.
Yes. Both the AM1802EZWTD3 and AM1806BZCEA3 integrate an ARM926EJ-S RISC core running at up to 375 MHz, with 16 KB instruction and 16 KB data caches, and both include the ARM ETM and embedded trace buffer for debug. Core architecture and maximum operating frequency are common across the two parts.
Both devices provide a 16/32-bit DDR2/mDDR SDRAM controller, asynchronous EMIF (NOR/NAND), and a rich peripheral set including USB 2.0 OTG with integrated PHY, 10/100 Ethernet MAC, three UARTs, two SPI ports, two I2C ports, and an LCD controller. They also integrate an uPP (universal parallel port) and a 16-bit host-port interface. Exact channel counts and pin availability should be confirmed against the specific device datasheet because package ball-out affects which peripherals are bonded out.
Not directly. Because the two parts use different package ball-outs (ZWT vs ZCE), the PCB footprint and signal routing differ, so a direct substitution is not possible without a board redesign. Additionally, the AM1806BZCEA3 offers the wider industrial temperature range. Any migration must be validated against the manufacturer datasheets for pin mux, power sequencing, and peripheral availability.
For industrial applications requiring operation below 0°C or in electrically noisy/harsh environments, the AM1806BZCEA3 is the appropriate choice because it is specified over the industrial temperature range (-40°C to 90°C case). The AM1802EZWTD3, rated for the extended commercial range, is better suited to controlled-environment consumer or commercial designs. Final selection should also account for package ball-out and peripheral requirements.