ADUC812BS
類比設備
- Lifecycle
- Active
- Stock
- 2004 件
- Series
- 嵌入式-微控制器
對 ADUC812BS 和 ADUC832BSZ 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。
Replacement verdict
The ADUC832BSZ is a viable functional replacement candidate for the ADUC812BS, sharing the same 8-bit 8051-core MicroConverter architecture, identical 52-pin MQFP footprint, and matching on-chip 12-bit ADC and dual DAC resources. Designers should validate flash program memory size, SRAM capacity, and supply voltage tolerance against the specific application requirements before committing to a drop-in substitution.
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | ADUC832BSZ | ADUC812BS | Why it matters |
|---|---|---|---|
| Core Architecture | 8052-compatible 8-bit MCU core | 8052-compatible 8-bit MCU core | Both use the same 8052 instruction set, so firmware is largely portable between them. |
| Program Memory (Flash) | 62 kB Flash | 8 kB Flash | The much larger on-chip Flash of the ADUC832BSZ allows significantly larger application code without external memory. |
| On-Chip RAM | 2304 bytes | 256 bytes | More internal RAM reduces the need for external memory and supports more complex data handling. |
| ADC Resolution / Channels | 12-bit, 8-channel ADC | 12-bit, 8-channel ADC | Identical analog front-end capability means sensor interface circuits can be reused directly. |
| DAC Channels | 2 x 12-bit DACs | 2 x 12-bit DACs | Both provide dual voltage-output DACs, enabling analog output functions to be preserved across designs. |
| Maximum Clock Frequency | 16 MHz | 12 MHz | A higher maximum clock on the ADUC832BSZ yields greater processing throughput for timing-critical tasks. |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V | Matching supply ranges allow the same power supply design to be used for either part. |
| Package | 52-lead MQFP | 52-lead MQFP | Identical package and pinout simplify board-level drop-in substitution. |
| UART / Serial Interfaces | 1 x UART, SPI, I2C | 1 x UART, SPI, I2C | Same serial peripheral set preserves communication interfaces with external devices. |
| Operating Temperature Range | -40 °C to +85 °C | -40 °C to +85 °C | Equivalent industrial temperature ratings ensure the same environmental qualification applies. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | ADUC812BS | ADUC832BSZ |
|---|---|---|
| Brand | Analog Devices | - |
| Product Type | 8-bit Microcontrollers - MCU | - |
| Subcategory | Microcontrollers - MCU | - |
| Minimum Operating Temperature | - 40 C | - |
| Maximum Operating Temperature | + 85 C | - |
| Core | 8052 | - |
| Program Memory Size | 8 kB | 62KB (62K x 8) |
| Data RAM Size | 256 B | - |
| ADC Resolution | 12 bit | - |
| Number of I/O | 34 I/O | 34 |
| Supply Voltage - Min | 2.7 V, 4.5 V | - |
| Supply Voltage - Max | 3.3 V, 5.5 V | - |
| Mounting Type | SMD/SMT | Surface Mount |
| Data Bus Width | 8 bit | - |
| Series | ADUC812 | MicroConverter® ADuC8xx |
| Interface Type | SPI, UART | - |
| Number of ADC Channels | 8 Channel | - |
| Number of Timers / Counters | 3 Timer | - |
| Program Memory Type | Flash | FLASH |
| Data RAM Type | SRAM | - |
| Product | MCUs | - |
| DAC Resolution | 12 bit | - |
| Watchdog Timers | Watchdog Timer | - |
| Processor Series | ADUC812 | - |
| Development Kit | EVAL-ADuC812QSZ | - |
| Part Status | - | Active |
| Core Processor | - | 8052 |
| Core Size | - | 8-Bit |
| Speed | - | 16MHz |
| Connectivity | - | EBI/EMI, I²C, SPI, UART/USART |
| Peripherals | - | PSM, Temp Sensor, WDT |
| EEPROM Size | - | 4K x 8 |
| RAM Size | - | 2.25K x 8 |
| Voltage - Supply (Vcc/Vdd) | - | 2.7V ~ 5.5V |
| Data Converters | - | A/D 8x12b; D/A 2x12b |
| Oscillator Type | - | Internal |
| Operating Temperature | - | -40°C ~ 125°C (TA) |
The ADUC832BSZ is a MicroConverter with an 8052 core, 62 kB flash memory, 2304 bytes of on-chip RAM, and a 12-bit ADC, while the ADUC812BS offers 8 kB flash, 256 bytes of on-chip RAM, and a 12-bit ADC. The ADUC832BSZ provides significantly more program and data memory, making it suitable for larger firmware applications.
Both devices are offered in a 52-lead MQFP package, but pin compatibility must be verified against the respective datasheets because peripheral functions and pin assignments can differ. Designers should confirm the pinout of each device before considering a direct board-level substitution.
Both the ADUC832BSZ and ADUC812BS integrate a 12-bit successive-approximation ADC with an 8-channel input multiplexer. The ADC performance specifications, such as throughput rate and input range, should be confirmed from the respective manufacturer datasheets.
Both the ADUC832BSZ and ADUC812BS integrate dual 12-bit voltage-output DACs and an on-chip voltage reference. These integrated analog peripherals make both parts suitable for closed-loop control and sensor-signal applications.
The ADUC832BSZ provides 62 kB of on-chip flash program memory and 2304 bytes of on-chip data RAM. The ADUC812BS provides 8 kB of on-chip flash program memory and 256 bytes of on-chip data RAM. The larger memory of the ADUC832BSZ supports more complex firmware and data buffering.
Both devices include a UART serial port, an SPI interface, and an I2C-compatible interface. These interfaces support communication with external sensors, memory devices, and host controllers in embedded systems.
Both the ADUC832BSZ and ADUC812BS operate from a 3 V to 3.6 V supply and are specified for the industrial temperature range of −40°C to +85°C. These ratings should be confirmed against the latest manufacturer datasheet for the specific grade ordered.
A drop-in replacement should not be assumed. Although both are 8052-core MicroConverters in a 52-lead MQFP package with similar analog peripherals, differences in memory size, pin functions, and peripheral configuration require validation against both datasheets and the target design before substitution.