Part A
ADSP-BF547BBCZ-5A
ADI公司
- Lifecycle
- Active
- Stock
- 6462 件
- Series
- 嵌入式-DSP（數位信號處理器）
Replacement verdict
Not a drop-in replacement
The ADSP-BF547BBCZ-5A and ADSP-BF536BBC-4A are not drop-in replacements for one another. They differ in core performance class, on-chip memory density, integrated peripheral set, and package footprint, so substituting one for the other requires full schematic, firmware, and layout revalidation rather than a direct swap.
Different core performance class
Different on-chip memory density
Different integrated peripheral set
Different package footprint
Parts at a glance
Part B
ADSP-BF536BBC-4A
ADI公司
- Lifecycle
- Active
- Stock
- 4718 件
- Package
- LFBGA-182
- Series
- 嵌入式-DSP（數位信號處理器）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | ADSP-BF547BBCZ-5A | ADSP-BF536BBC-4A | Why it matters |
|---|---|---|---|
| Core Clock Frequency (Max) | 500 MHz | 400 MHz | Higher clock speed yields more processing throughput; a slower core may not meet real-time signal-processing budgets. |
| On-chip SRAM | 260 KB (L1 + L2) | 132 KB (L1 + L2) | SRAM capacity determines how much code and data can run without external memory, affecting latency and board complexity. |
| Package / Pin Count | BGA-400 (17 x 17 mm) | BGA-208 (17 x 17 mm) | Different package and pin count means the PCB footprint and routing are not drop-in compatible. |
| External Memory Interface | DDR/SDRAM, async memory, NAND/NOR flash controller | SDRAM, async memory, NAND/NOR flash controller | DDR support on the BF547 enables higher memory bandwidth; the BF536 is limited to SDRAM, constraining memory-intensive designs. |
| Ethernet MAC | 10/100 Ethernet MAC | 10/100 Ethernet MAC | Both integrate an Ethernet MAC, so networked applications can be supported on either part without an external controller. |
| USB Support | USB 2.0 HS OTG (with PHY) | USB 2.0 FS device (with PHY) | High-speed OTG on the BF547 supports faster host/device links; the BF536 is limited to full-speed device mode. |
| PPI / Video Interface | PPI with ITU-R 656 support | PPI (no ITU-R 656) | ITU-R 656 support on the BF547 enables direct video capture; the BF536 lacks this, limiting imaging applications. |
| Supply Voltage (Core) | 1.10 V - 1.47 V (VDDINT) | 0.80 V - 1.32 V (VDDINT) | Different core voltage ranges require different power-supply design and may affect power consumption and thermal budget. |
| Operating Temperature Range | -40 °C to +85 °C (industrial) | -40 °C to +85 °C (industrial) | Both are rated for industrial temperature, so environmental robustness is equivalent for harsh deployments. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | ADSP-BF547BBCZ-5A | ADSP-BF536BBC-4A |
|---|---|---|
| Supplier | - | Rochester Electronics, LLC |
| Series | Blackfin® | Blackfin® |
| Part Status | Active | Obsolete |
| Type | Fixed Point | Fixed Point |
| Interface | SPI, SSP, TWI, UART, USB | CAN, SPI, SSP, TWI, UART |
| Clock Rate | 533MHz | 400MHz |
| Non - Volatile Memory | External | External |
| On - Chip RAM | 260kB | 100kB |
| Voltage - I / O | 2.50V, 3.30V | 2.50V, 3.30V |
| Voltage - Core | 1.25V | 1.20V |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C |
| Mounting Type | Surface Mount | Surface Mount |
| Base Product Number | ADSP-BF547 | - |
| Packaging | Tray | - |
Frequently asked questions
What are the key architectural differences between the ADSP-BF547BBCZ-5A and the ADSP-BF536BBC-4A?
The ADSP-BF547BBCZ-5A is a Blackfin BF54x series processor with a 533 MHz core clock, 260 KB on-chip SRAM, integrated Ethernet MAC, USB 2.0 HS OTG, and a 400-ball BGA package. The ADSP-BF536BBC-4A is a Blackfin BF53x series processor with a 400 MHz core clock, 132 KB on-chip SRAM, integrated Ethernet MAC, and a 208-ball BGA package. The BF547 offers higher core frequency, more on-chip memory, and additional high-speed peripherals such as USB OTG.
Are the ADSP-BF547BBCZ-5A and ADSP-BF536BBC-4A pin-compatible?
No. The ADSP-BF547BBCZ-5A uses a 400-ball BGA package, while the ADSP-BF536BBC-4A uses a 208-ball BGA package. The ball counts, ball maps, and package dimensions differ, so they are not pin-compatible and cannot be interchanged on the same PCB footprint without redesign.
Can the ADSP-BF536BBC-4A be used as a drop-in replacement for the ADSP-BF547BBCZ-5A?
No. Beyond the package and pinout differences, the two devices differ in core clock speed (400 MHz vs 533 MHz), on-chip SRAM size (132 KB vs 260 KB), and peripheral set (the BF547 includes USB 2.0 HS OTG, which the BF536 does not). A drop-in replacement is not possible; any substitution requires schematic, layout, and firmware validation against the respective datasheets.
What are the core clock speeds and on-chip memory sizes of these two processors?
The ADSP-BF547BBCZ-5A operates at a core clock of 533 MHz and integrates 260 KB of on-chip SRAM. The ADSP-BF536BBC-4A operates at a core clock of 400 MHz and integrates 132 KB of on-chip SRAM. These values are specified in the respective Analog Devices Blackfin datasheets.
Do both processors include an integrated Ethernet MAC?
Yes. Both the ADSP-BF547BBCZ-5A and the ADSP-BF536BBC-4A integrate a 10/100 Ethernet MAC on-chip, as documented in their respective Analog Devices Blackfin datasheets. External PHY and magnetics are still required for a complete Ethernet interface.
Which high-speed serial interfaces distinguish the ADSP-BF547BBCZ-5A from the ADSP-BF536BBC-4A?
The ADSP-BF547BBCZ-5A integrates a USB 2.0 High-Speed OTG controller, which is not present on the ADSP-BF536BBC-4A. Both devices provide other serial connectivity such as UART, SPI, and TWI/I2C, but the USB HS OTG capability is a distinguishing peripheral of the BF547.
What are the package and temperature grade specifications for these two parts?
The ADSP-BF547BBCZ-5A is supplied in a 400-ball BGA package, and the ADSP-BF536BBC-4A is supplied in a 208-ball BGA package. Both are specified for the industrial temperature range of −40 °C to +85 °C, per their Analog Devices datasheets. Designers should confirm the exact package and temperature suffix against the ordering guide before release.