Part A
ADSP-BF532SBBCZ400
ADI公司
- Lifecycle
- Active
- Stock
- 3868 件
- Package
- LFBGA-160
- Series
- 嵌入式-DSP(數位信號處理器)
對 ADSP-BF532SBBCZ400 和 ADSP-BF533SBBC500 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。
ADI公司
ADI公司
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | ADSP-BF532SBBCZ400 | ADSP-BF533SBBC500 |
|---|---|---|
| Supplier | - | Rochester Electronics, LLC,Analog Devices Inc. |
| Series | Blackfin® | Blackfin® |
| Part Status | Active | Obsolete |
| Type | Fixed Point | Fixed Point |
| Interface | SPI, SSP, UART | SPI, SSP, UART |
| Clock Rate | 400MHz | 500MHz |
| Non - Volatile Memory | ROM (1kB) | ROM (1kB) |
| On - Chip RAM | 84kB | 148kB |
| Voltage - I / O | 3.30V | 3.30V |
| Voltage - Core | 1.20V | 1.20V |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount | Surface Mount |