5CEFA9F27I7N
訊息
- Lifecycle
- Active
- Stock
- 7586 件
- Package
- BGA-672
- Series
- 嵌入式FPGA(現場可程式設計閘陣列)
對 5CEFA9F27I7N 和 5CEFA2M13C6N 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。
Replacement verdict
The 5CEFA9F27I7N and 5CEFA2M13C6N are not drop-in replacements for one another. They differ fundamentally in logic density, package footprint, and speed grade, making them suitable for entirely different design requirements rather than interchangeable use.
訊息
訊息
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA9F27I7N | 5CEFA2M13C6N | Why it matters |
|---|---|---|---|
| Family / Series | Cyclone V E | Cyclone V E | Same FPGA family ensures toolchain, IP, and pinout conventions are compatible, easing design migration. |
| Logic Elements (LE) | 301,000 | 25,000 | LE count determines the amount of logic that can be implemented; a large mismatch prevents direct functional substitution. |
| Package | FBGA-672 | MBGA-383 | Different packages have different footprints and pin counts, so they are not drop-in compatible on the same PCB. |
| Operating Temperature Range | -40°C to 100°C (Industrial) | 0°C to 85°C (Commercial) | Temperature grade affects reliability in harsh environments; industrial parts are required for extended-temperature applications. |
| Speed Grade | 7 (fastest) | 6 (slower) | Speed grade determines maximum operating frequency and timing closure; a slower grade may not meet the same performance targets. |
| Embedded Memory (M10K blocks) | 1,220 | 140 | On-chip memory capacity limits buffering, FIFO, and data storage capability; a large difference restricts functional equivalence. |
| 18x18 Multipliers | 684 | 72 | DSP multiplier count determines signal-processing throughput; fewer multipliers limit arithmetic-intensive designs. |
| User I/O Pins | 336 | 224 | I/O count constrains the number of external interfaces; fewer pins may prevent connecting all required peripherals. |
| Transceiver Count | 9 | 0 | High-speed serial transceivers enable protocols like PCIe and Ethernet; their absence in one part blocks those interfaces entirely. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA9F27I7N | 5CEFA2M13C6N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 113560 | 9434 |
| Number of Logic Elements/Cells | 301000 | 25000 |
| Total RAM Bits | 14251008 | 2002944 |
| Number of I/O | 336 | 223 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
The 5CEFA9F27I7N is a larger Cyclone V FPGA in the F27 package with 301,000 logic elements, while the 5CEFA2M13C6N is a smaller Cyclone V device in the M13 package with 25,000 logic elements. They differ in logic density, package, I/O count, and speed grade.
No. The 5CEFA9F27I7N uses a 672-pin FBGA (F27) package, while the 5CEFA2M13C6N uses a 383-pin Micro FBGA (M13) package. The package sizes, ball counts, and pinouts are different, so they are not drop-in replacements.
The 5CEFA9F27I7N contains 301,000 logic elements. The 5CEFA2M13C6N contains 25,000 logic elements. These values are specified in the Intel Cyclone V device family datasheet.
The 5CEFA9F27I7N is specified with speed grade 7 (I7). The 5CEFA2M13C6N is specified with speed grade 6 (C6). Speed grade affects timing performance and must be considered when migrating designs.
Yes. Both the 5CEFA9F27I7N and the 5CEFA2M13C6N are members of the Intel Cyclone V F-series FPGA family, which shares the same architecture, IP support, and development toolchain.
No. The 5CEFA2M13C6N has significantly fewer logic elements, fewer I/O pins, a different package, and a different speed grade. A direct substitution would require a full design re-evaluation and is not supported without redesign.
The 5CEFA9F27I7N is offered in a 672-ball FBGA package designated F27. The 5CEFA2M13C6N is offered in a 383-ball Micro FBGA package designated M13. Package dimensions and PCB land patterns differ between them.
Yes. Both the 5CEFA9F27I7N and the 5CEFA2M13C6N are supported by Intel Quartus Prime software, which provides device-specific fitting, timing analysis, and programming support for the Cyclone V family.