Part A
5CEFA9F23I7N
訊息
- Lifecycle
- Active
- Stock
- 4366 件
- Package
- BGA-484
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Replacement verdict
Not a drop-in replacement
The 5CEFA9F23I7N and 5CEFA2U19A7N are not functionally interchangeable. They differ fundamentally in logic density, package footprint, and I/O count, making them unsuitable as direct substitutes in the same PCB design. The 5CEFA9F23I7N offers significantly higher logic capacity and I/O in a larger FBGA package, while the 5CEFA2U19A7N provides a compact UBGA option with lower density. Designers must redesign the board layout and re-verify timing, power, and thermal performance if migrating between these devices.
Different logic density
Different package type
Different I/O count
Different footprint
Parts at a glance
Part B
5CEFA2U19A7N
訊息
- Lifecycle
- Active
- Stock
- 2002 件
- Package
- FBGA-484
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA9F23I7N | 5CEFA2U19A7N | Why it matters |
|---|---|---|---|
| Family | Cyclone V E | Cyclone V E | Same FPGA family ensures toolchain and IP compatibility. |
| Logic Elements (LEs) | 301,000 | 25,000 | LE count determines available logic capacity for the design. |
| Total RAM (Mbits) | 12,200 | 1,760 | Embedded memory affects buffering and data storage capability. |
| 18x18 Multipliers | 684 | 72 | DSP blocks impact arithmetic and signal processing performance. |
| Package | FBGA-484 | UBGA-484 | Package type affects PCB footprint, assembly, and thermal characteristics. |
| Operating Temperature | -40°C to 100°C (TJ) | -40°C to 125°C (TJ) | Temperature range determines suitability for industrial or harsh environments. |
| Supply Voltage | 1.07V to 1.13V | 1.07V to 1.13V | Core voltage must match board power design for reliable operation. |
| Speed Grade | 7 | 7 | Speed grade influences maximum operating frequency and timing closure. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA9F23I7N | 5CEFA2U19A7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 113560 | 9434 |
| Number of Logic Elements/Cells | 301000 | 25000 |
| Total RAM Bits | 14251008 | 2002944 |
| Number of I/O | 224 | 224 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 125°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA9F23I7N and the 5CEFA2U19A7N?
The 5CEFA9F23I7N is a Cyclone V FPGA with 301,000 logic elements, 1,836 embedded multipliers, and 12,200 Kbits of embedded memory in a 484-pin FBGA package. The 5CEFA2U19A7N is a Cyclone V FPGA with 25,000 logic elements, 132 embedded multipliers, and 1,400 Kbits of embedded memory in a 484-pin UBGA package. The 5CEFA9F23I7N offers significantly higher logic density, memory, and DSP resources, while the 5CEFA2U19A7N is a lower-density device in a smaller package footprint.
Are the 5CEFA9F23I7N and 5CEFA2U19A7N pin-to-pin compatible?
No. The 5CEFA9F23I7N uses a 484-pin FBGA package (23 mm x 23 mm), while the 5CEFA2U19A7N uses a 484-pin UBGA package (19 mm x 19 mm). The package dimensions, ball pitch, and PCB land patterns differ, so they are not pin-to-pin compatible and cannot be interchanged without a PCB redesign.
Can the 5CEFA2U19A7N be used as a direct drop-in replacement for the 5CEFA9F23I7N?
No. Beyond the package incompatibility, the two devices have different logic densities, memory capacities, and DSP resources. A design targeting the 5CEFA9F23I7N cannot be directly migrated to the 5CEFA2U19A7N without recompiling the FPGA design, verifying resource utilization, and redesigning the PCB for the different package footprint.
What is the operating temperature range for both the 5CEFA9F23I7N and 5CEFA2U19A7N?
Both devices are specified for the industrial temperature grade, indicated by the "I" in the part number suffix. The industrial grade for Cyclone V FPGAs supports a junction temperature range of -40°C to +100°C (Tj), as defined in the Intel Cyclone V Device Datasheet. The "7" speed grade applies to both devices.
Do both devices support the same transceiver speeds and protocols?
No. The 5CEFA9F23I7N, being a higher-density Cyclone V F-variant device, supports transceiver speeds up to 3.125 Gbps and includes more high-speed transceiver channels. The 5CEFA2U19A7N, as a lower-density Cyclone V device, has fewer transceiver channels and lower maximum transceiver data rates. The exact transceiver count and speed grades must be verified against the specific device datasheet and ordering information.
What are the typical applications for each device?
The 5CEFA9F23I7N is suited for high-bandwidth applications such as industrial imaging, video processing, and high-performance motor control that require large logic density and DSP resources. The 5CEFA2U19A7N is typically used in cost-sensitive, lower-density applications such as simple protocol bridging, sensor interfacing, and basic control logic where board space and power are constrained.
Are the configuration and power supply requirements the same for both devices?
Both devices belong to the Intel Cyclone V family and share similar configuration schemes (e.g., active serial, passive serial, JTAG) and core voltage requirements (typically 1.1 V for the core). However, the exact power supply rail requirements, decoupling, and configuration file sizes differ due to the different logic densities. Designers must consult the respective device pin-out files and power supply design guidelines for each part number.