Part A
5CEFA7F23I7N
訊息
- Lifecycle
- Active
- Stock
- 7313 件
- Package
- FBGA-484
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Replacement verdict
Not a drop-in replacement
The 5CEFA7F23I7N and 5CEFA2U19A7N are not drop-in replacements for each other. They differ in logic density, package footprint, I/O count, and operating temperature grade, so a direct substitution is not feasible without a full board and timing redesign.
Different logic density
Different package footprint
Different I/O count
Different temperature grade
Parts at a glance
Part B
5CEFA2U19A7N
訊息
- Lifecycle
- Active
- Stock
- 2002 件
- Package
- FBGA-484
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA7F23I7N | 5CEFA2U19A7N | Why it matters |
|---|---|---|---|
| Family / Series | Cyclone V E | Cyclone V E | Same device family ensures toolchain, IP, and pinout compatibility for migration. |
| Logic Elements (LE) | 149,500 | 25,000 | Logic capacity determines the complexity of designs the FPGA can implement. |
| Total RAM Bits | 7,880,448 | 1,843,200 | Embedded memory affects buffering, data storage, and DSP capability. |
| Number of I/Os | 480 | 224 | I/O count limits peripheral interfaces and external device connectivity. |
| Package / Case | FBGA-484 | UBGA-484 | Package type affects PCB footprint, assembly, and thermal characteristics. |
| Operating Temperature | -40°C to 100°C (TJ) | -40°C to 125°C (TJ) | Temperature range determines suitability for industrial or harsh environments. |
| Supply Voltage | 1.07V to 1.13V | 1.07V to 1.13V | Core voltage must match power design for correct operation and reliability. |
| Speed Grade | 7 | 7 | Speed grade impacts maximum operating frequency and timing closure. |
| Transceiver Count | 9 | 3 | Transceivers enable high-speed serial protocols like PCIe and Ethernet. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA7F23I7N | 5CEFA2U19A7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 56480 | 9434 |
| Number of Logic Elements/Cells | 149500 | 25000 |
| Total RAM Bits | 7880704 | 2002944 |
| Number of I/O | 240 | 224 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 125°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA7F23I7N and the 5CEFA2U19A7N?
The 5CEFA7F23I7N and 5CEFA2U19A7N are both Intel (formerly Altera) Cyclone V FPGAs, but they differ in logic density, package, and I/O count. The 5CEFA7F23I7N offers a larger logic array (approximately 150K logic elements) in a 484-pin FBGA package, while the 5CEFA2U19A7N provides a smaller logic array (approximately 25K logic elements) in a 484-pin UBGA package. These differences affect resource availability, power consumption, and PCB layout requirements.
Are the 5CEFA7F23I7N and 5CEFA2U19A7N pin-compatible?
No. The 5CEFA7F23I7N uses a 484-pin FBGA package (F23), while the 5CEFA2U19A7N uses a 484-pin UBGA package (U19). Although both have 484 pins, the package types, ball maps, and thermal characteristics differ, so they are not pin-compatible or drop-in replacements.
Can the 5CEFA2U19A7N be used as a direct substitute for the 5CEFA7F23I7N?
No. The two devices have different logic densities, package types, and I/O capabilities. A direct substitution would require a complete redesign of the PCB, power delivery, and configuration circuitry. Always verify resource requirements and pin assignments against the respective datasheets before considering any replacement.
What are the operating temperature ranges for these two FPGAs?
Both the 5CEFA7F23I7N and 5CEFA2U19A7N are specified for industrial temperature range (I7 suffix), which typically covers -40°C to +100°C junction temperature. For exact thermal specifications, refer to the Intel Cyclone V device datasheet and the respective product ordering information.
Which device is better suited for low-power applications?
The 5CEFA2U19A7N is generally better suited for low-power applications due to its smaller logic density and UBGA package, which typically offers lower static and dynamic power consumption compared to the larger 5CEFA7F23I7N. However, actual power consumption depends on the specific design, clock frequencies, and I/O usage. Use Intel's Early Power Estimator (EPE) tool for accurate comparison.
Do both devices support the same configuration methods?
Yes. Both the 5CEFA7F23I7N and 5CEFA2U19A7N are Cyclone V FPGAs and support the same configuration schemes, including active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG configuration. The configuration file size differs due to different logic densities, so the configuration memory requirements will vary.
What are the typical applications for each device?
The 5CEFA7F23I7N, with its higher logic density, is typically used in more complex applications such as industrial motor control, image processing, and communication infrastructure. The 5CEFA2U19A7N, with lower density and smaller package, is often used in cost-sensitive and space-constrained applications like portable devices, simple control interfaces, and sensor fusion.