Part A
5CEBA2F17C8N
訊息
- Lifecycle
- Active
- Stock
- 4153 件
- Package
- BGA-256
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Replacement verdict
Compatible functional replacement candidate
The 5CEBA2F17C8N and 5CEBA4U19C7N are both Intel Cyclone V FPGA devices sharing the same core architecture and logic cell family, making them functionally related but not drop-in equivalent. The 5CEBA4U19C7N offers higher logic density and a faster speed grade, while the 5CEBA2F17C8N provides a larger on-chip memory footprint and a different package footprint. Designers must validate pinout, thermal, and power delivery requirements before substituting one for the other in an existing design.
Logic Density
Validation required
Package Type
Validation required
Speed Grade
Validation required
Embedded Memory
Validation required
Parts at a glance
Part B
5CEBA4U19C7N
訊息
- Lifecycle
- Active
- Stock
- 7845 件
- Package
- FBGA-484
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEBA2F17C8N | 5CEBA4U19C7N | Why it matters |
|---|---|---|---|
| Family / Series | Cyclone V E | Cyclone V E | Same device family ensures toolchain, IP, and pinout compatibility for migration. |
| Logic Elements (LE) | 25,000 | 49,000 | LE count determines available logic capacity; a large difference affects whether a design fits. |
| Total RAM (M9K + MLAB) | 1,430 Kbit | 3,080 Kbit | On-chip memory limits buffering, FIFO depth, and embedded processing capability. |
| 18x18 Multipliers | 36 | 70 | DSP block count governs arithmetic throughput for signal processing functions. |
| Package | FBGA-256 | UBGA-484 | Different packages require different PCB footprints and cannot be drop-in replaced. |
| User I/O Count | 128 | 224 | I/O count limits peripheral interfaces and must match system connectivity needs. |
| Speed Grade | 8 | 7 | Speed grade affects maximum clock frequency and timing closure margin. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | Temperature grade determines suitability for commercial versus industrial environments. |
| Core Supply Voltage | 1.1 V | 1.1 V | Core voltage must match power supply design for correct operation. |
| Transceiver Support | None | None | Absence of high-speed transceivers limits serial protocol support such as PCIe or SATA. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEBA2F17C8N | 5CEBA4U19C7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 9434 | 18480 |
| Number of Logic Elements/Cells | 25000 | 49000 |
| Total RAM Bits | 2002944 | 3464192 |
| Number of I/O | 128 | 224 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEBA2F17C8N and the 5CEBA4U19C7N?
The 5CEBA2F17C8N is a Cyclone V E FPGA with 25,000 logic elements, 2,500 adaptive logic modules (ALMs), and 1,080 Kbits of embedded memory in a 256-pin FBGA (17x17 mm) package. The 5CEBA4U19C7N is a Cyclone V E FPGA with 49,000 logic elements, 4,900 ALMs, and 3,080 Kbits of embedded memory in a 484-pin UBGA (19x19 mm) package. The 5CEBA4U19C7N offers higher logic density, more memory, and a larger package with more user I/O, while the 5CEBA2F17C8N provides a smaller footprint and lower logic capacity.
Are the 5CEBA2F17C8N and 5CEBA4U19C7N pin-to-pin compatible?
No. The 5CEBA2F17C8N uses a 256-pin FBGA package (17x17 mm), while the 5CEBA4U19C7N uses a 484-pin UBGA package (19x19 mm). The different package sizes, ball counts, and ball maps make them physically and electrically incompatible for direct PCB replacement.
Can the 5CEBA2F17C8N be used as a drop-in replacement for the 5CEBA4U19C7N?
No. Beyond the package incompatibility, the 5CEBA4U19C7N has approximately twice the logic elements (49,000 vs 25,000), more ALMs (4,900 vs 2,500), and more embedded memory (3,080 Kbits vs 1,080 Kbits). A design targeting the 5CEBA4U19C7N may exceed the resources of the 5CEBA2F17C8N, and the pinout differs, so a direct drop-in replacement is not possible without redesign.
What are the operating temperature ranges for these two FPGAs?
Both the 5CEBA2F17C8N and the 5CEBA4U19C7N are specified for commercial temperature operation, typically 0°C to 85°C junction temperature (TJ), as indicated by the "C" in the ordering code (C8N and C7N). Industrial and automotive temperature grades are available in other ordering options but are not applicable to these specific part numbers.
What speed grade does each part use, and how does it affect performance?
The 5CEBA2F17C8N uses speed grade 8, while the 5CEBA4U19C7N uses speed grade 7. In Altera/Intel Cyclone V devices, a lower speed grade number indicates a faster device. Therefore, the 5CEBA4U19C7N (grade 7) offers higher maximum operating frequencies and tighter timing performance than the 5CEBA2F17C8N (grade 8), assuming equivalent logic utilization and design conditions.
Do both devices support the same configuration and transceiver options?
Both are Cyclone V E family FPGAs and support similar configuration schemes, including active serial (AS), passive serial (PS), and JTAG. However, the 5CEBA4U19C7N, with its larger 484-pin UBGA package, provides more user I/O and may expose additional high-speed transceiver channels or hard IP blocks compared to the 5CEBA2F17C8N in its 256-pin FBGA package. Designers must consult the respective device pin-out files and datasheets to confirm available transceiver and hard IP resources for each specific part number.
Which part is more suitable for a space-constrained, low-power design?
The 5CEBA2F17C8N is more suitable for space-constrained designs due to its smaller 17x17 mm, 256-pin FBGA package and lower logic density, which generally translates to lower static and dynamic power consumption compared to the larger 5CEBA4U19C7N. The 5CEBA4U19C7N is better suited for designs requiring higher logic capacity, more memory, and additional I/O, where the larger 19x19 mm, 484-pin UBGA package can be accommodated.
Are these parts RoHS compliant and lead-free?
Both the 5CEBA2F17C8N and the 5CEBA4U19C7N are offered in lead-free, RoHS-compliant packages as standard from Intel (formerly Altera). The "N" suffix in both ordering codes indicates lead-free (Pb-free) construction. Designers should verify the specific product change notices (PCNs) and environmental compliance declarations from Intel or authorized distributors for the latest status.