Part A
10M40DCF672C8G
訊息
- Lifecycle
- Active
- Stock
- 5081 件
- Package
- BGA-672
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Replacement verdict
Compatible functional replacement candidate
The 10M40DCF672C8G and 10M40DAF484C7G are both Intel (Altera) MAX 10 field-programmable gate arrays sharing the same 40,000-logic-element density, non-volatile configuration architecture, and 3.3 V/1.2 V core supply family, making them functionally interchangeable at the device level. However, they differ in package footprint (672-ball FBGA vs. 484-ball FBGA), maximum user I/O count, and speed grade (C8 vs. C7), so a direct drop-in replacement is not possible without PCB redesign and timing re-verification. The 10M40DAF484C7G is the better choice where board space is constrained and a slightly slower speed grade is acceptable, while the 10M40DCF672C8G suits designs requiring higher I/O density and faster timing closure.
Logic Density
High match
Package Type
Validation required
I/O Count
Not compatible
Speed Grade
Validation required
Parts at a glance
Part B
10M40DAF484C7G
訊息
- Lifecycle
- Active
- Stock
- 9007 件
- Package
- BGA-484
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M40DCF672C8G | 10M40DAF484C7G | Why it matters |
|---|---|---|---|
| Package / Case | 672-FBGA (27x27) | 484-FBGA (23x23) | Different package footprints and ball counts are not drop-in compatible; PCB layout must be redesigned. |
| Operating Temperature | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | Temperature grade affects reliability and suitability for the target environment. |
| Speed Grade | 8 | 7 | A faster speed grade (lower number) supports higher clock frequencies and tighter timing margins. |
| Logic Elements (LE) | 40000 | 40000 | Logic capacity determines how much digital logic can be implemented in the device. |
| Total RAM Bits | 1261568 | 1261568 | Embedded memory capacity affects buffering, data storage, and DSP functionality. |
| Number of I/Os | 500 | 360 | Available I/O count limits peripheral and interface connectivity options. |
| Supply Voltage | 1.15V to 1.25V | 1.15V to 1.25V | Core voltage must match the board power design for correct operation. |
| Mounting Type | Surface Mount | Surface Mount | Mounting style must match the assembly process and board design. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M40DCF672C8G | 10M40DAF484C7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 2500 | 2500 |
| Number of Logic Elements/Cells | 40000 | 40000 |
| Total RAM Bits | 1290240 | 1290240 |
| Number of I/O | 500 | 360 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 10M40DCF672C8G and the 10M40DAF484C7G?
The primary differences are package type, pin count, and speed grade. The 10M40DCF672C8G is a 672-pin FineLine BGA (FBGA) device with a speed grade of 8, while the 10M40DAF484C7G is a 484-pin FineLine BGA (FBGA) device with a speed grade of 7. Both are Intel (Altera) MAX 10 family FPGAs with 40,000 logic elements (LEs) and dual-configuration flash memory.
Are the 10M40DCF672C8G and 10M40DAF484C7G functionally interchangeable?
No. Although both are 40K LE MAX 10 devices, they differ in package footprint (672-pin vs 484-pin FBGA), pin count, and speed grade (8 vs 7). The 672-pin package provides more user I/O and dedicated pins than the 484-pin package. A direct drop-in replacement is not possible without PCB redesign and timing revalidation.
What is the logic density of both the 10M40DCF672C8G and 10M40DAF484C7G?
Both devices feature 40,000 logic elements (LEs), which is the "40" designation in the part number. They also include 1,260 Kbits of M9K embedded memory, 126 embedded 18x18 multipliers, and four phase-locked loops (PLLs), as documented in the Intel MAX 10 FPGA device overview.
What does the speed grade difference (C8 vs C7) mean for the 10M40DCF672C8G and 10M40DAF484C7G?
The "C8" in 10M40DCF672C8G indicates a commercial temperature range with speed grade 8, while "C7" in 10M40DAF484C7G indicates commercial temperature range with speed grade 7. Speed grade 7 is faster than speed grade 8, meaning the 10M40DAF484C7G supports higher maximum operating frequencies and tighter timing margins than the 10M40DCF672C8G.
Do the 10M40DCF672C8G and 10M40DAF484C7G support dual configuration flash memory?
Yes. Both devices are MAX 10 FPGAs with dual-configuration flash memory, allowing them to store two configuration images. This feature supports instant-on operation and fail-safe updates. The dual-configuration capability is common to all MAX 10 40K LE devices regardless of package or speed grade.
What are the operating temperature ranges for the 10M40DCF672C8G and 10M40DAF484C7G?
Both devices have a "C" suffix in their part numbers, indicating commercial temperature range operation, typically 0°C to 85°C junction temperature (TJ). Industrial and automotive temperature variants exist in the MAX 10 family but are denoted by different suffixes (I or A) and are not applicable to these specific part numbers.
Can the 10M40DCF672C8G be used as a substitute for the 10M40DAF484C7G in an existing design?
No, not without significant redesign. The 672-pin FBGA package of the 10M40DCF672C8G is physically larger and has a different ball grid array than the 484-pin FBGA package of the 10M40DAF484C7G. Additionally, the speed grade difference (8 vs 7) affects timing closure. A substitution requires a new PCB layout, updated pin assignments, and full timing revalidation.
What configuration options are available for the 10M40DCF672C8G and 10M40DAF484C7G?
Both devices support multiple configuration schemes including active serial (AS), passive serial (PS), and JTAG configuration. They also feature internal configuration flash memory, allowing them to operate without an external configuration device. Configuration details are documented in the Intel MAX 10 FPGA Configuration User Guide.