10M25DCF484C8G
訊息
- Lifecycle
- Active
- Stock
- 3416 件
- Package
- BGA-484
- Series
- 嵌入式FPGA(現場可程式設計閘陣列)
對 10M25DCF484C8G 和 10M25DAF484C7G 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。
Replacement verdict
The 10M25DCF484C8G and 10M25DAF484C7G are both Intel MAX 10 FPGA devices sharing the same 25,000-logic-element density and 484-ball FBGA package, making them functionally interchangeable in many designs. However, they differ in speed grade and operating temperature range, so the 10M25DAF484C7G should be validated against the target application's timing and thermal requirements before being used as a drop-in substitute for the 10M25DCF484C8G.
訊息
訊息
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M25DCF484C8G | 10M25DAF484C7G | Why it matters |
|---|---|---|---|
| Family | MAX 10 FPGA | MAX 10 FPGA | Same device family ensures compatible architecture, toolchain, and IP support. |
| Logic Elements (LEs) | 25,000 | 25,000 | Matching logic capacity allows the same design to fit without resource changes. |
| Package | 484-pin FBGA | 484-pin FBGA | Identical package ensures the same PCB footprint and pinout compatibility. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | Temperature grade affects reliability and suitability for the target environment. |
| Speed Grade | 8 (Fastest) | 7 (Faster) | Speed grade determines maximum operating frequency and timing closure margin. |
| On-Chip Flash (Configuration) | Dual Configuration (D) | Analog & Flash (A) | Configuration flash options affect instant-on capability and design flexibility. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Same core voltage ensures identical power supply design requirements. |
| User I/O Count | 360 | 360 | Matching I/O count preserves interface capability and board-level connectivity. |
| Embedded Memory (M9K) | 1,152 Kbits | 1,152 Kbits | Equal embedded memory supports the same buffering and storage requirements. |
| 18x18 Multipliers | 120 | 120 | Same DSP resource count ensures identical arithmetic and signal processing capability. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M25DCF484C8G | 10M25DAF484C7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1563 | 1563 |
| Number of Logic Elements/Cells | 25000 | 25000 |
| Total RAM Bits | 691200 | 691200 |
| Number of I/O | 360 | 360 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Both are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the 10M25 density tier, featuring 25,000 logic elements (LEs), non-volatile integrated flash configuration, and a 484-pin FineLine BGA (FBGA) package. The 10M25DCF484C8G is specified with a commercial temperature grade and speed grade 8, while the 10M25DAF484C7G is specified with an automotive temperature grade and speed grade 7.
The primary differences are the temperature grade and speed grade. The 10M25DCF484C8G uses the "C" commercial temperature grade (typically 0°C to 85°C junction) with speed grade 8, whereas the 10M25DAF484C7G uses the "A" automotive temperature grade (typically -40°C to 125°C junction) with speed grade 7. Both share the same 10M25 die, 484-pin FBGA package, and MAX 10 feature set.
Yes. Both devices are offered in the same 484-pin FineLine BGA (FBGA) package with the same pinout for the 10M25 density, so the physical footprint and pin assignments are identical. However, pin-compatibility does not guarantee functional interchangeability without validating timing, temperature, and speed-grade requirements.
Not automatically. Although they share the same package and die, the different speed grades (8 vs. 7) and temperature grades (commercial vs. automotive) affect timing closure, maximum operating frequency, and environmental limits. A design must be re-timed and validated against the target device's speed grade and temperature range before substitution.
In Intel MAX 10 ordering codes, a lower speed-grade number indicates a faster device. Speed grade 7 (10M25DAF484C7G) provides faster maximum operating frequencies and tighter timing than speed grade 8 (10M25DCF484C8G). Designs closed on speed grade 8 may not meet timing if migrated to speed grade 7 without re-analysis, and vice versa.
The 10M25DCF484C8G carries the commercial "C" temperature grade, and the 10M25DAF484C7G carries the automotive "A" temperature grade. The automotive-grade device is intended for applications requiring extended temperature operation and automotive qualification, while the commercial-grade device targets standard commercial environments. Exact junction temperature limits should be confirmed in the Intel MAX 10 device datasheet.
Yes. Both the 10M25DCF484C8G and 10M25DAF484C7G are MAX 10 FPGAs, which integrate non-volatile flash configuration memory. This enables instant-on operation and single-chip configuration without an external configuration device, a feature common to the entire MAX 10 family.
The 10M25DAF484C7G is the appropriate choice for automotive applications because its "A" temperature grade and automotive qualification align with under-hood or extended-temperature requirements. The 10M25DCF484C8G, with its commercial temperature grade, is generally not intended for automotive-qualified designs.