10M16DCU324I7G
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- Lifecycle
- Active
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- 8453 件
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- 嵌入式FPGA(現場可程式設計閘陣列)
對 10M16DCU324I7G 和 10M16DCU324C8G 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。
Replacement verdict
The 10M16DCU324I7G is a functionally compatible replacement candidate for the 10M16DCU324C8G, as both devices share the same Intel MAX 10 FPGA family, 16,000 logic elements, 324-pin UBGA package, and identical I/O and transceiver resources. The primary distinction is the temperature grade and speed grade, with the industrial-grade I7G offering a wider operating temperature range and faster timing closure than the commercial-grade C8G. Designers should validate timing margins and thermal requirements before substituting in applications that are temperature-sensitive or timing-critical.
阿爾特拉
阿爾特拉
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DCU324C8G | 10M16DCU324I7G | Why it matters |
|---|---|---|---|
| Operating Temperature Range | 0°C to 85°C (Commercial) | -40°C to 100°C (Industrial) | Determines the environments in which the device can reliably operate; industrial grade supports harsher conditions. |
| Speed Grade | 8 | 7 | A lower speed grade number indicates faster maximum operating frequency and tighter timing performance. |
| Logic Elements (LEs) | 16000 | 16000 | Defines the available programmable logic capacity for implementing user designs. |
| Package | 324-pin UBGA | 324-pin UBGA | Must match the PCB footprint for physical interchangeability. |
| Supply Voltage | 1.2 V core | 1.2 V core | Core voltage must be compatible with the board power design for correct operation. |
| Embedded Memory | 562 kbit | 562 kbit | On-chip memory capacity affects ability to store data, buffers, and configuration. |
| Number of I/O Pins | 246 | 246 | I/O count determines how many external signals the device can interface with. |
| Multiplier (18x18) Blocks | 160 | 160 | Dedicated multipliers support DSP functions such as filtering and arithmetic acceleration. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M16DCU324I7G | 10M16DCU324C8G |
|---|---|---|
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Digi Key Programmable | Not Verified | Not Verified |
| Number of LA Bs / CL Bs | 1000 | 1000 |
| Number of Logic Elements / Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 246 | 246 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
| Packaging | Tray | Tray |
The primary differences are the operating temperature grade and the speed grade. The 10M16DCU324C8G is specified for commercial temperature range (0°C to 85°C junction) with a speed grade of 8, while the 10M16DCU324I7G is specified for industrial temperature range (-40°C to 100°C junction) with a speed grade of 7. Both devices are Intel (Altera) MAX 10 field-programmable gate arrays (FPGAs) with 16,000 logic elements in a 324-pin UBGA package.
Yes. Both devices share the same 324-pin UBGA package (package code U324) and the same device family (MAX 10 10M16). The pinout and package dimensions are identical, so they are pin-to-pin compatible. However, the industrial-grade 10M16DCU324I7G may have different timing characteristics due to its faster speed grade (7 vs. 8).
Not unconditionally. While the package and pinout are identical, the 10M16DCU324I7G is rated for a wider industrial temperature range (-40°C to 100°C junction) and has a faster speed grade (7). Replacing an industrial-grade device with a commercial-grade device may violate the target system's thermal requirements. Additionally, timing closure must be re-verified because the speed grade difference affects propagation delays and maximum operating frequency.
Both devices feature 16,000 logic elements (LEs), which is the defining characteristic of the 10M16 device density within the Intel MAX 10 FPGA family. They also include embedded memory blocks, analog-to-digital converter (ADC) blocks, and internal configuration flash memory, as documented in the Intel MAX 10 FPGA device overview.
The 10M16DCU324C8G is a commercial-grade device, typically specified for a junction temperature range of 0°C to 85°C. The 10M16DCU324I7G is an industrial-grade device, typically specified for a junction temperature range of -40°C to 100°C. These temperature ranges are defined in the Intel MAX 10 FPGA datasheet and must be respected for reliable operation.
Yes. Both devices are part of the Intel MAX 10 family, which features internal configuration flash memory. They support the same configuration schemes, including active serial (AS), passive serial (PS), and JTAG configuration, as well as internal configuration from the on-chip flash. The configuration methodology is identical across both speed and temperature grades.
The 10M16DCU324I7G is more suitable for industrial and automotive applications that require operation below 0°C or above 85°C junction temperature. Its industrial temperature rating (-40°C to 100°C junction) and faster speed grade (7) make it preferable for harsh environments and timing-critical designs. The 10M16DCU324C8G is intended for commercial applications with controlled temperature environments.
Yes. Both devices are offered in RoHS-compliant packages as part of Intel's MAX 10 FPGA product line. The "G" suffix in the ordering code indicates RoHS compliance and lead-free packaging. Specific compliance documentation should be verified through Intel's product material declarations or authorized distributors such as DigiKey or Mouser.